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Aug 18, 2017
High Reliability & High Temperature Application Solution -- Solder Joint Encapsulant Paste
Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology -- solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International ...
YINCAE Advanced Materials
Aug 17, 2017
KLA-Tencor Announces New FlashScan Product Line for Inspection of Optical and EUV Reticle Blanks
KLA-Tencor Corporation announced the new FlashScan™ reticle blank* inspection product line. While KLA-Tencor has been a major presence in patterned reticle ...
KLA-Tencor
Aug 17, 2017
Automated Thickness Measurement System Speeds Production
The labor-intensive, manual process of recording precise measurements across various wafer coordinates is now programmable for automated data collection and report ...
Acu-Gage Systems
Aug 17, 2017
High Reliability & High Throughput Ball Bumping Process Solution -- Solder Joint Encapsulant Adhesive
Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology -- solder joint encapsulant adhesives for ball bumping, at the 2017 International Symposium ...
YINCAE Advanced Materials
Aug 16, 2017
MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing
MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support our photonics customers' high volume manufacturing requirements. The MRSI-HVM3 is in full ...
MRSI Systems
Aug 16, 2017
EpoxySet offers EP-207, UL Approved, Thermally Conductive epoxy
EpoxySet offers EP-207, thermally conductive epoxy potting and encapsulating compound for electronics and heat dissipating devices. This room temperature curing ...
EpoxySet
Aug 16, 2017
Plasma-Therm and Trymax Partner to Distribute Resist Ashing Products in North America
Plasma-Therm LLC, and Trymax Semiconductor Equipment BV, announced that they have entered into a distribution agreement for North America. The agreement gives Plasma-Therm ...
Plasma-Therm LLC
Aug 15, 2017
ISSI Introduces AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Markets
Integrated Silicon Solution, Inc. (ISSI) announced at the Flash Memory Summit (FMS) that it has begun sampling production units of automotive grade Serial (SPI) ...
Integrated Silicon Solution, Inc. (ISSI)
Aug 15, 2017
SEMI Europe Supports Call for Action on European Manufacturing Policy
SEMI confirmed its support for joint industry/government cooperation to advance European manufacturing policy. A Joint-Declaration signed by SEMI Europe and 129 other ...
SEMI
Aug 14, 2017
Programmable Color Sequence RGB LED Driver for IoT applications
Integrated Silicon Solution, Inc. introduced the IS31FL3194, the latest addition to the innovative line of FxLED RGB drivers. The IS31FL3194 is a fully programmable 3 ...
Integrated Silicon Solution, Inc. (ISSI)