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Mar 22, 2018
UnitySC Acquires HSEB Dresden, Becomes Semiconductor Process Control Leader
UnitySC announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review and metrology for high-value ...
UnitySC
Mar 21, 2018
On Semi Device Converter Allows TSOPs to be used in SOIC footprint without re-spinning mother board
Ironwood Electronics' new device converter - DC-SO/SO-AKL24323-L-01 allows customers to use 0.65mm pitch TSOP on a 1.27mm pitch SOIC footprint. These device ...
Ironwood Electronics
Mar 21, 2018
Flemish scientists win prestigious American cash prize
Communication can save lives. But what if existing technology is no longer available, after an attack for example? Scientists from IDLab, a core imec research group ...
imec
Mar 20, 2018
EB-135LP, Optically clear, Yellow resistant epoxy
epoxySet is pleased to offer the EB-135LP, water white epoxy that resists yellowing. This high strength, structural adhesive can be used for encapsulating and sealing LEDs, ...
EpoxySet
Mar 20, 2018
Thermo Fisher Scientific Showcases New Solutions in the Fab and Lab at SEMICON China
Thermo Fisher Scientific announces new products that improve quality control and yield in semiconductor manufacturing. These new products will be showcased at SEMICON China ...
Thermo Fisher Scientific
Mar 19, 2018
EV Group and IBM Sign License Agreement on Laser Debonding Technology
EV Group and IBM announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM's patented Hybrid Laser ...
EV Group
Mar 19, 2018
Imec Honors Qualcomm Founder Irwin M. Jacobs with Lifetime of Innovation Award
Imec presented its annual Lifetime of Innovation Award to Dr. Irwin Jacobs, Founding Chairman and CEO Emeritus of Qualcomm. The annual industry honor is presented ..
Imec
Mar 16, 2018
GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Explosive Demand for Datacenter Connectivity
GLOBALFOUNDRIES revealed new details of its silicon photonics roadmap to enable the next generation of optical interconnects for datacenter and cloud applications. ...
GLOBALFOUNDRIES
Mar 16, 2018
Well established advanced packaging manufacturer in Taiwan selects Trymax
Trymax Semiconductor Equipment BV announced that a Taiwanese establishes advanced packaging manufacturer selects Trymax for their new advanced packaging technology. ...
Trymax Semiconductor Equipment
Mar 16, 2018
Multitest Sensor Test Modules Ready for Increased Productions Needs
Multitest has now launched the next generation of its 6DOF gyro test module for singulated packages, which provides significant production benefits resulting in even ...
Multitest Elektronische Systeme GmbH