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Sep 11, 2018
Announcing Kronosos™ 1080 and ICOSos™ F160 Inspection Systems
KLA-Tencor Corporation announced two new defect inspection products designed to address a wide variety of integrated circuit (IC) packaging challenges. The Kronos™ 1080 ...
KLA-Tencor Corporation
Sep 10, 2018
Indium Corporation Experts to Present at IMAPS 2018
Indium Corporation experts will share their industry knowledge and skill at IMAPS 2018 from Oct. 8-11 in Pasadena, Calif. The following technical presentations from ...
Indium Corporation
Sep 10, 2018
Brewer Science Unveils BrewerBOND® and BrewerBUILD™ Material
Brewer Science, Inc., from SEMICON Taiwan 2018, introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials ...
Brewer Science, Inc.
Sep 10, 2018
MicroLEDs: technology advancements pave the way for cost reduction
MicroLEDs technologies are improving rapidly and new technology paths emerging at a rapid pace. According to Yole Développement's analysts, technology solutions should ...
Yole Développement
Sep 10, 2018
China's Semiconductor Fab Capacity to Reach 20% in 2020, Equipment Market Expected to Rise to Top
The China IC Ecosystem Report, a comprehensive report for the IC manufacturing supply chain, reveals that front-end fab capacity in China will grow to account for 16% ...
SEMI
Sep 7, 2018
Industry's Only Worldwide OSAT Manufacturing Sites Database Now Tracks 320 Facilities
SEMI and TechSearch International announced a new edition of the Worldwide OSAT Manufacturing Sites Database -- the only outsourced semiconductor assembly and testing ...
SEMI
Sep 7, 2018
Xcerra's MT2168 XT Semiconductor Test Handler now available with advanced Double Device Detection and Automatic Temperature Calibration
Xcerra has added two new optional features to the MT2168 XT pick-and-place handler. Both options target optimization of test floor processes, allowing the customer ...
Xcerra Corporation
Sep 7, 2018
Leti and VSORA Demonstrate 3GPP New Radio on MultiCore Digital Signal Processor
Leti announced they have demonstrated the implementation of 5G New Radio (5G NR) Release 15 on a new DSP architecture that can dramatically reduce time to market ...
Leti
Sep 7, 2018
The next revolution in electroless copper for advanced FPCB is now available
Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface ...
Atotech Deutschland GmbH
Sep 6, 2018
MRSI Systems Announces 'One Stop Shop' Die Bonding Solutions at CIOE and ECOC
MRSI Systems (Mycronic Group) will be demonstrating our "One Stop Shop" capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen ...
MRSI Systems