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Mar 2, 2018
Brewer Science's OptiLign™ DSA Product Family Provides an Alternative for Advanced-Node Wafer Patterning
Brewer Science, Inc., from SPIE Advanced Lithography 2018 introduced its OptiLign™ commercial-quality directed self-assembly (DSA) material set developed in collaboration ...
Brewer Science, Inc.
Mar 2, 2018
Indium Features Gold Alloy Solder Preforms at SPIE Defense + Commercial Sensing Expo
Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Defense + Commercial Sensing Expo, April 15-19, in Orlando, Fla. Depending on the alloy ...
Indium Corporation
Mar 2, 2018
Bosch Sensortec launches high performance barometric pressure sensor BMP388 for CE drones
Bosch Sensortec introduces a new high performance barometric pressure MEMS sensor: the BMP388 is ideally suited for altitude tracking in Consumer Electronics ...
Bosch Sensortec
Mar 2, 2018
ClassOne Equipment Selected to Upgrade Major UK Fab
ClassOne Equipment has announced the sale of multiple systems to a major global components manufacturer as part of a significant upgrade to their UK fab. Semitool ...
ClassOne Equipment
Mar 1, 2018
Imec Announces Advances in EUV Lithography
Imec continues to advance the readiness of EUV lithography with particular focus on EUV single exposure of Logic N5 metal layers, and of aggressive dense hole arrays ...
Mar 1, 2018
Inova Semiconductors announces standalone LED driver for in-car lighting
Inova Semiconductors announces a new standalone smart RGB LED driver and controller, the INLC100Q16. This is the latest member of Inova's ISELED family, a truly revolutionary ...
Inova Semiconductors
Mar 1, 2018
ISELED Alliance accelerates automotive LED light design with new evaluation kit
The ISELED Alliance launches a new evaluation kit for ISELED, a digital smart RGB LED solution for automotive ambient lighting. The evaluation kit allows developers ...
ISELED Alliance
Mar 1, 2018
10nm pattern generation using thermal scanning probe lithography enabled by simplified materials and processes
Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation uses a thermally sensitive ...
Feb 28, 2018
UTAC delivers high-density System in a Package (SiP) Service for Octavo Systems
UTAC Holdings Ltd through ongoing investments in its Dongguan facility, is now enabled with capabilities to serve the most demanding System in a Package (SiP) ...
Feb 28, 2018
52 GHz Bandwidth Socket for BGA228 Package
Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.65mm pitch BGA package. The SG25-BGA-2045 socket is designed for a 11mmx11mm ...
Ironwood Electronics