Jul 2, 2019
CMOS Image Sensor Packaging Technology for Automotive Applications
In this paper, we present novel methods for packaging image sensors on laminate substrates, enabling a reduction in cost, form ...
Jun 28, 2019
Sockets and Adapters
Remember the days when everything was in a DIP package? Big parts, easy to see, easily fixed by soldering technician. ...
Jun 24, 2019
Thin Is In
This article discusses the market drivers and technical challenges related to handling and working with ultra-thin devices. Being able to ...
Jun 17, 2019
Advanced Wafer Level PKG Solutions for Telecom Infrastructure
In this work, a highly integrated WiGig/802.11ad compliant 16+16 beam forming transceiver RFIC with advanced FOWLP (fan out wafer level ...
Jun 5, 2019
New Generation Routable QFN for Power SiP Applications
To overcome several limitations in package assembly, UTAC is developing an inkjet insulation process for GQFN (GQFNi), targeting to provide ...
May 10, 2019
2.5D Package and HDFO Advanced Heterogeneous Packaging Solutions
This article introduces packaging technology platforms developed by Amkor Technology including: 2.5D TSV interposer, CoS, CoW and HDFO. ...
Amkor Technology, Inc.
May 3, 2019
Case Study: Extreme Low-Void, Lead Free Soldering for Power Modules
Electronic packaging for power modules requires a highly reliable solder connection and extremely low void rate to deliver high quality ...
Palomar Technologies, Inc.
Apr 29, 2019
11 Myths About SiP
The prevalence of system-in-package technology in a host of different applications has invariably led to myths about it. UTAC's Lee ...
Apr 4, 2019
Bondtesting of Memory Devices
Bondtesting memory devices means dealing with overhanging and stacked die. Nordson DAGE have a patented test method to ensure no ...
Mar 28, 2019
Challenges & Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Delivery of cost effective assembly solutions for smaller, faster electronic packages for end markets in Telecom/Datacom, Aerospace & Defense, Medical ...
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