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Jan 18, 2017
VIEWPOINT 2017: Barmak Mansoorian, President & Co-Founder, Forza Silicon
This year we celebrate Forza Silicon's 16th anniversary in the business of delivering innovative custom CMOS image sensor (CIS) and IC design solutions. Technological advancements in devices and architectures are still remarkable in the CIS marketplace. Stacked sensor design technology was once ...
Jan 17, 2017
VIEWPOINT 2017: Greg DeLarge, President, Plasma Etch, Inc.
2016 has been an exciting year for Plasma Etch, and 2017 looks to be even better. We continue to see strong growth in vacuum and atmospheric system sales. We recently introduced our patented gasless etching technology in our Mark II line of plasma systems. This allows us to etch and desmear ...
Jan 16, 2017
VIEWPOINT 2017: Bill Moffat, Founder & CEO, Yield Engineering Systems, Inc.
Wafer-Level Packaging (FOWLP). In 2017, YES will expand our YES-450PB Series Dielectric Vacuum Cure Oven sales to sustain the FOWLP market. The YES proprietary process allows less than four hours process time with controllable 4° per minute ramp rates. Another industry we are making great advances ...
Jan 13, 2017
VIEWPOINT 2017: Marco Notarianni, Ph.D., Platform Manager, Singulator®
Plasma-Therm® is a leading provider of advanced plasma processing equipment that has won "RANKED 1st" awards every year since 2012 from the VLSIresearch Customer Satisfaction Survey. Plasma-Therm systems perform critical process steps in the fabrication of integrated circuits, micro-mechanical devices ...
Jan 12, 2017
VIEWPOINT 2017: Tony NG, Key Account Manager, AMETEK Programmable Power
AMETEK is looking forward to 2017 as a year of growth for the semiconductor industry. We'll continue to develop high power solutions for semiconductor process and test applications, while offering higher power densities and the best customer service for engineers in both the fab and development lab. We see ...
Jan 11, 2017
VIEWPOINT 2017: Daniel F. Crowley, Vice President of Sales, MRSI Systems
MRSI Systems is a leading manufacturer of fully automated, ultra-precision die bonding and epoxy dispensing systems. Our systems are able to deliver the unique combination of speed, ultra-high precision and flexibility. MRSI's systems are built on common platforms that can be configured to meet specific ...
Jan 10, 2017
VIEWPOINT 2017: Thomas Uhrmann, Director of Business Development, EV Group
Looking back on 2016, the semiconductor industry witnessed many new developments in advanced packaging. Among these was the production of the first hybrid bonded image sensor, which enables high-performance image processing as well as on-sensor memory to provide faster extraction and processing ...
Jan 9, 2017
VIEWPOINT 2017: Scott Smith, Director of Business Development, SemiDice
2016 was unexpectedly a growth year over the solid 2015 we experienced. This was, in part, to the continued expansion of products offered in bare die and wafer form coupled with the critical need to design applications with focus on miniaturization, portability and decreased weight. We expect 2017 ...
Jan 6, 2017
VIEWPOINT 2017: Arthur Sherman, VP Corporate Strategy & Marketing, Applied Materials
Going into 2017, Applied Materials is well positioned to enable a number of new technology applications for emerging trends such as big data, IoT, cloud infrastructure, artificial intelligence, augmented and virtual reality, and smart vehicles. These applications significantly add to existing semiconductor ...
Jan 5, 2017
VIEWPOINT 2017: Rob Kavanagh, Global Business Director, Dow Electronic Materials
Looking back at last year's predictions for fan-out wafer- and panel-level packaging, the crystal ball was a bit foggy, as the industry collectively wondered if fan-out would become a reality in mainstream consumer applications, such as smartphones and tablets. Now with confirmation from teardowns ...