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Feb 2, 2018
VIEWPOINT 2018: Tim Going, President, StratEdge
Packaging high-frequency semiconductor devices has always been an afterthought, but 5G and its high-power infrastructure and IoT and advanced cellular technologies requiring RF and microwave frequencies will make package selection critical. Packages not only are necessary for heat dissipation, but also ensure ...
Feb 1, 2018
VIEWPOINT 2018: Marco Notarianni, Ph.D., Platform Manager, Singulator®,

Plasma-Therm is a leading provider of advanced plasma processing equipment whose products and services have been recognized throughout its 40-plus year history by multiple honors, including 37 awards in the global Customer Satisfaction Survey conducted annually by VLSIresearch. We anticipate an especially exciting ...
Jan 31, 2018
VIEWPOINT 2018: Stephen Hiebert, Senior Director of Marketing, KLA-Tencor
For KLA-Tencor's back-end semiconductor business, our 2018 focus will be primarily on the industry's most advanced wafer-level packaging platforms (fan-out WLP, fan-in WLP, 2.5D/interposer, and 3D-IC), sophisticated 3D packaging methods like SIP, evolving automotive packaging requirements and the need for larger ...
Jan 30, 2018
VIEWPOINT 2018: Michael Chalsen, President, MRSI Systems
MRSI Systems enters 2018 with its strongest family of products since the company was formed in 1984. The need has never been greater for customers to optimize their performance of such metrics as process yield, throughput, and uptime. The recent launch of our MRSI-HVM3, a high speed, flexible, 3 micron die bonder ...
Jan 29, 2018
VIEWPOINT 2018: Ricardo Fuentes, President/CEO, MATECH
At MATECH we make our business to keep an eye on the horizon. There is not much use for looking at what's immediately afoot since, about that, there is not much you can do. You need to see ahead--far ahead. Last year, I wrote about what was likely to emerge as the dominant drivers in our industry. I mentioned memristors ...
Jan 26, 2018
VIEWPOINT 2018: Jim Fraine, Director of Sales, Marvin Test Solutions
Marvin Test Solutions is looking forward to 2018 as a year of growth for our entire semiconductor test product line - a range of flexible, scalable solutions to address wafer and packaged test applications in both engineering and production environments. 2017 was a year of solid growth for the semiconductor ...
Jan 25, 2018
VIEWPOINT 2018: Thibault Buisson, Business Unit Manager, Yole Développement
2017 has been an impressive year for the semiconductor industry. After a few years of market downturn, this industry has shown a strong dynamism with attractive innovations and encouraging market figures. 2017 allowed semiconductor companies to confirm their market positioning and expand their activities towards ...
Jan 24, 2018
VIEWPOINT 2018: Andy C. Mackie, PhD, Senior Product Manager, Indium Corporation
Indium Corporation is well known as a reliable and innovative PCB and semiconductor assembly materials manufacturer and supplier. It is only by listening to customers that we can get the broad and deep insights into upcoming technology needs, that will keep Indium Corporation leading the electronics assembly industry ...
Jan 23, 2018
VIEWPOINT 2018: Rob Kavanagh, Global Business Director, Dow Electronic Materials
Fan-out wafer-level packaging (FOWLP) was the big advanced packaging story coming into 2017, and we expect to see that trend continue well into 2018 and beyond driven largely by the smartphone market. While we don't anticipate any drastic paradigm shifts in the latest generation of smartphones, the adoption of FOWLP ...
Jan 22, 2018
VIEWPOINT 2018: Tony D. Flaim, CTO, WLP Materials Business Unit, Brewer Science
Fan-out processes captured much of the interest across all levels of the semiconductor packaging industry in 2017, including most major IDMs, foundries and OSATs. It will continue to consume much of their attention in 2018 as manufacturers sort out which forms of fan-out best respond to the high-volume ...