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Mar 24, 2017
iTAC Software AG to Debut I4.0 platform at the HANOVER TRADE FAIR 2017
iTAC Software AG is showcasing smart MES and IoT products at this year's HANOVER TRADE FAIR, stand C16 in hall 7. The highlight exhibit at this year's fair is the new ...
iTAC Software AG
Mar 23, 2017
MicroLEDs for displays: how we can make it happen...
Many large companies and startups are currently working on microLED technologies for display applications: from LED makers such as Epistar, Nichia or Osram to display ...
Yole Développement
Mar 23, 2017
Ultratech Receives Follow-On Multiple Orders From China Foundries For Laser Spike Annealing Systems
Ultratech, Inc. announced that two China foundries placed follow-on orders for laser spike anneal systems. Ultratech's LSA101 laser spike anneal systems will be used ...
Ultratech, Inc.
Mar 23, 2017
SEMI Headquarters Relocates
SEMI announced that it has moved its headquarters office to Milpitas, Calif. The new SEMI office is approximately five miles (eight kilometers) from the former location ...
SEMI
Mar 22, 2017
MRSI Systems Delivered 3-Micron Die Bonder MRSI-M3 to AIM Photonics Academy
MRSI Systems announces the installation of its flagship MRSI-M3 Die Bonder in AIM Photonics Academy's Education and Practice Factory at MIT in Cambridge, MA. This is the ...
MRSI System
Mar 22, 2017
CSP LED lighting modules: a revolution within the LED industry?
"We estimates that CSP LED modules represented less than 1% of the LED module business in 2016", says Pierrick Boulay, Market & Technology Analyst at Yole "However, with ...
Yole Développement
Mar 22, 2017
Package Converter Technology converts QFN Device to BGA Footprint
Ironwood Electronics' new adapter for the 16 pin BGA device allow use of the equivalent IC in QFN package to be used in PCB boards developed for BGA packages. The PC-QFN16A/BGA16C-01 ...
Ironwood Electronics
Mar 22, 2017
M+W Group on a Successful Streak with Semiconductor Awards
Leading global high-tech engineering company, M+W Group is celebrating their recent successes in semiconductor projects with awards in both China and Taiwan. M+W Group ...
M+W Group
Mar 21, 2017
STATS ChipPAC Achieves 1.5 Billion Unit Milestone in Fan-out Wafer Level Packaging Shipments
STATS ChipPAC Pte. Ltd. announced that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid ...
STATS ChipPAC
Mar 21, 2017
Atlas Copco Appoints New Semiconductor Divisions Presidents
Edwards Limited is now part of the newly-formed Vacuum Technique business area of Atlas Copco. Mike Allison has been appointed President of the Semiconductor division ...
Edwards Limited