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May 19, 2017
Imec demonstrates self-learning neuromorphic chip that composes music
At the imec technology forum (ITF2017), imec demonstrated the world's first self-learning neuromorphic chip. The brain-inspired chip, based on OxRAM technology, has ...
Imec
May 19, 2017
EC-1030FL -- High temperature, flexible epoxy potting compound
epoxySet introduces EC-1030FL. This, flexible, two part epoxy is designed to replace silicones for potting, encapsulating, and casting applications where temperatures ...
epoxySet
May 18, 2017
EV Group Achieves Milestone with Over 1100 Wafer Bond Chambers Installed Worldwide
EV Group (EVG) announced that it has achieved an industry milestone with more than 1100 EVG wafer bonding chambers installed at customer facilities worldwide to date. ...
EV Group
May 18, 2017
40 GHz Bandwidth Socket for BGA796 Package
Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch BGA package. The SG25-BGA-2032 socket is designed for a 12mmx12mm ...
Ironwood Electronics
May 18, 2017
New ams Foundry Ecosystem provides solutions for ASIC design service, testing and fabrication
ams announced at the CDNLive EMEA a further expansion of its Foundry Ecosystem. In cooperation with Fraunhofer IIS and RoodMicrotec, these three partners now open an additional ...
ams AG
May 18, 2017
Two Component, Low Viscosity Epoxy Features Outstanding Chemical Resistance
Master Bond EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. ...
Master Bond
May 17, 2017
Amkor to Exhibit and Present at the Upcoming ECTC 2017
Amkor Technology presents to ECTC 2017 in Lake Buena Vista, Florida on May 30th - June 2nd located at the Walt Disney World Swan and Dolphin Resort. The Electronic ...
Amkor Technology, Inc.
May 17, 2017
Atotech presents next generation technologies at ECTC 2017
Atotech will present its next generation plating technologies for FO-Panel Level Packaging (FO-PLP) at the upcoming ECTC 2017, held from May 30 to June 2, 2017, at the Walt Disney ...
Atotech Deutschland GmbH
May 17, 2017
New ams Foundry Ecosystem provides solutions for ASIC design service, testing and fabrication
ams announced at the CDNLive EMEA a further expansion of its Foundry Ecosystem. In cooperation with Fraunhofer IIS and RoodMicrotec, these three partners now open ...
ams AG
May 16, 2017
Win Semiconductor increases wafer manufacturing capacity by 20%
WIN Semiconductors Corp has completed phase 2 expansion at its newest wafer fab, Fab C. This operation is now fitted with state-of-the-art clean rooms, efficient process ...
WIN Semiconductors Corp