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Dec 22, 2017
COF packaging in growing demand
With COF (chip on film) package technology increasingly emerging as a mainstream packaging method for driver ICs for smartphone-use LCD ...
Digitimes
Dec 22, 2017
ASE, SPIL to hold shareholders meetings February 12 for merger affairs
Taiwan IC packaging and testing specialists Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will convene respective ... ...
Digitimes
Dec 22, 2017
Micron's Momentum Continues
Micron Technology is starting its new fiscal year on a high note, reporting quarterly revenue of $6.8 billion, while continuing ...
EE Times
Dec 22, 2017
China LED chip makers reduce prices
China's largest LED epiwafer and chip maker Sanan Optoelectronics has lowered its quotations for LED chips, in particular by 20% ...
Semiconductor Today
Dec 22, 2017
Semiconductor Equipment Sales Back on the Rise
Sales by North American semiconductor equipment manufacturers increased in November compared with October, the first month of sequential increase in ...
EE Times
Dec 21, 2017
Will Fab Tool Boom Cycle Last?
Fab equipment spending is on pace for a record year in 2017, and it now appears that momentum could continue ...
Semiconductor Engineering
Dec 21, 2017
IEDM 2017: Intel's 10nm Platform Process
IEDM this year was its usual mixture of academic exotica and industrial pragmatica (to use a very broad-brush description), but ...
ElectroIQ
Dec 21, 2017
Micron's Momentum Continues
Micron Technology is starting its new fiscal year on a high note, reporting quarterly revenue of $6.8 billion, while continuing ...
EE Times
Dec 21, 2017
China LED chip makers reduce prices
China's largest LED epiwafer and chip maker Sanan Optoelectronics has lowered its quotations for LED chips, in particular by 20% ...
Semiconductor Today
Dec 21, 2017
Taiwan IC designers stand to benefit from booming gaming market
With market demand for gaming consoles and notebooks to stay robust for a long while along with the growing popularity ...
Digitimes