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Jan 16, 2018
Indium Corporation Announces New Corporate Leadership
Indium Corporation has promoted Greg Evans to CEO, and Ross Berntson to President and COO. Former CEO and company owner William Macartney III will continue serving ...
Indium Corporation
Jan 16, 2018
Virtual Industries Recognizes Patrick Lemos for 20 Years of Service
Virtual Industries Inc. is pleased to announce that Patrick Lemos is celebrating 20 years of service with the company. Lemos is the general manager for Virtual Industries. ...
Virtual Industries Inc.
Jan 15, 2018
Indium Technology Experts to Present at Pan Pacific Microelectronics Symposium 2018
Indium Corporation's Dr. Ron Lasky, Senior Technologist, and Sze Pei Lim, Semiconductor Product Manager for Asia, will present at Pan Pacific Microelectronics Symposium ...
Indium Corporation
Jan 15, 2018
Boston Semi Equipment Receives Multisystem Order for Innovative Zeus Pressure MEMS Test Handler
Boston Semi Equipment (BSE) announced that it has received a multisystem order for its Zeus gravity feed systems for handling pressure MEMS devices. The order was placed ...
Boston Semi Equipment
Jan 12, 2018
Ravi Parthasarthy to Present at SMTA Space Coast Expo and Tech Forum
ZESTRON is pleased to announce that Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas, will present "Design for Reliability: Overcoming Present ...
Jan 12, 2018
Nikon Metrology XT V 160 checks power semiconductor devices in production line
IXYS UK Westcode, part of the global power semiconductor manufacturer, IXYS Corporation, is investing in its Chippenham, UK factory to manufacture a new range ...
Nikon Metrology
Jan 11, 2018
Nuheara's Live IQ, 'true wireless' ANC earbud, is powered by ams' ANC technology
ams revealed that global earbud manufacturer Nuheara is using the miniature ams AS3412 Active Noise Cancellation (ANC) IC to provide best-in-class hybrid noise cancellation ...
ams AG
Jan 11, 2018
Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound ...
Master Bond
Jan 10, 2018
SEMI and Fab Owners Association Strengthen Supply Chain
After several years of close partnership, SEMI and the Fab Owners Association (FOA) have fully integrated. Driving manufacturing efficiencies remains the overriding ...
Jan 10, 2018
STMicroelectronics Selects GLOBALFOUNDRIES 22FDX® to Extend Its FD-SOI Platform and Technology Leadership
GLOBALFOUNDRIES and STMicroelectronics announced that ST has selected GF's 22nm FD-SOI (22FDX®) technology platform to support its next-generation of processor solutions ...