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Jun 28, 2018
Seica Inc New Haverhill headquarters celebration
On 6 June SEICA inc. has officially inaugurated the new North American headquarters in the Ward Hill Business Park East of Haverhill, Massachusetts. The new offices are located ...
Seica Inc
Jun 27, 2018
3D-Micromac Introduces Selective Laser Annealing System
3D-Micromac AG unveiled the microPRO™ RTP--its new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing ...
3D-Micromac AG
Jun 27, 2018
Epoxy Features Very Low Coefficient of Thermal Expansion
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating ...
Master Bond
Jun 27, 2018
Leti Demonstrates New Waveform for 5G Low-Power Wide-Area IoT Networks
Leti announced that field trials of its new Low Power Wide Area (LPWA) technology, a waveform tailored for Internet of Things (IoT) applications, showed significant ...
Leti
Jun 27, 2018
Winbond Extends Performance of Serial NAND Flash Memory
Winbond Electronics Corporation announced the introduction of the W25N01JW, a highperformance, 1.8V Serial NAND Flash memory IC delivering a new high ...
Winbond Electronics Corporation
Jun 26, 2018
Preview for Seica Inc. Participation at Semicon West
Presented for the first time in US during IPC Apex, it will also be shown at Semicon West booth 509, Pilot V8 Next> series, the most versatile and performing flying ...
Seica
Jun 26, 2018
Magnetic sensor market: the increasing adoption of the xMR technologies
Magnetic sensors have been historically dominated by Hall-effect technology. However, this situation has evolved over time, with increasing penetration of xMR technologies ...
Yole Développement
Jun 26, 2018
UltraSoC embedded analytics and Imperas virtual platforms combine
UltraSoC and Imperas announced a wide-ranging partnership that will provide developers of multicore systems on chip (SoCs) with a powerful combination of embedded ...
UltraSoC
Jun 26, 2018
Machine-to-Machine Communication Standards
The SMT equipment communication rule standardization subcommittee (hereafter referred to as ELS) from the Japan Robot Association (hereafter referred to as JARA), of which Fuji ...
Fuj Corporation
Jun 25, 2018
YXLON International to Host Three Open House Events at Its Lab One Facility
YXLON International, a company of the Swiss tech holding, COMET Group, announces that it will host three Lab One Electronics Open Houses. The first one will take place on June 26 ...
YXLON