We search for industry news, so you don't need to.
Press Releases arrow   Page 15 of 515   arrow
Submit a Press Release
Nov 2, 2018
Stanford Nanofabrication Facility Partners with Finetech on Die Bonding Technologies
The FINEPLACER® Lambda, a flexible sub-micron die bonder for precision die attach and chip packaging, is an integral part of the SNF lab's equipment capabilities ...
Finetech
Oct 31, 2018
ZESTRON Americas Welcomes Mark McNeill as Executive Vice President
ZESTRON is pleased to announce that Mark McNeill has joined the company as the Executive Vice President, ZESTRON Americas. In this role, Mr. McNeill will oversee ...
ZESTRON
Oct 31, 2018
StratEdge Selects Casey Krawiec as Vice President of Global Sales
StratEdge Corporation announces it has selected Casey Krawiec as vice president of global sales. Krawiec will be responsible for the global sales of StratEdge's ...
StratEdge Corporation
Oct 31, 2018
NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature
Master Bond UV26 is a new one part UV curable system featuring an exceptionally high glass transition temperature (Tg) ranging from 160 to 170°C. This NASA low ...
Master Bond
Oct 30, 2018
The promise of deep grooves
A manufacturing technique that could help the semiconductor industry make more powerful computer chips began in the humblest of places -- at a lunch table at the ...
Argonne National Laboratory
Oct 30, 2018
CyberOptics to Show Airborne Particle, Ultra High-Res MRS Sensors at SEMICON Europa
CyberOptics® Corporation announces that it will exhibit at SEMICON Europa, scheduled to take place Nov. 13-16, 2018 at the Messe Munchen in Munich, Germany. The ...
CyberOptics® Corporation
Oct 30, 2018
System Plus Consulting, a strategic partner to understand innovations
There are many companies involved in reverse engineering, but none except System Plus Consulting has developed a smart methodology combining data gathering, technical ...
Yole Développement
Oct 29, 2018
Leti Middleware Will Be Core of Fog Platform for Decentralized Cloud-to-Edge AI
Leti announced that its sensiNact Internet of Things (IoT) middleware will be the core of a platform under development in an EU-Korean project that will empower emerging ...
Leti
Oct 29, 2018
Indium Corporation to Feature Thermal Interface Materials at Thermal Management Workshop
Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, CA ...
Indium Corporation
Oct 29, 2018
The challenges of obsolescence: how to shoehorn replacement parts into existing spaces
Nobody wants obsolescence in manufacturing equipment to be sprung on them as a nasty surprise and it is prudent to plan and manage to make sure that the product life ...
Ichor Systems Ltd