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Oct 18, 2018
Wafer Shipments Forecast to Set New Highs Through 2021
Total wafer shipments in 2018 year are expected to eclipse the all-time market high set in 2017 and continue to reach record levels through 2021, according to SEMI's recent ...
Oct 18, 2018
Virtual Industries' VC-3-075-AW-ESD VACULA 3 Kit with Barbed Anti-Wobble Fitting And 1 Cup
Virtual Industries Inc. now provides a product line of hand tools that replaces tweezers or other gripping means for many applications. Virtual Industries' most powerful ...
Virtual Industries Inc.
Oct 18, 2018
Junkosha seeks industry collaboration in desire to increase outgassing standardisation
Cabling and interconnect pioneer Junkosha is asking the semiconductor industry -- forecast to grow in 2018 and 2019 to US$ 463 billion and US$ 484 billion respectively ...
Oct 17, 2018
Practical Components® to Exhibit Wafer and Evaluation Vehicles Technologies at IWLPC
Practical Components® announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 - 15th Annual International Wafer-Level ...
Practical Components
Oct 17, 2018
Meyer Burger launches transformation programme to safeguard long-term profitability
Meyer Burger Technology Ltd launched a transformation programme and structural changes to further increase customer proximity, optimise its global production footprint ...
Meyer Burger Technology Ltd
Oct 17, 2018
SiFlower Licenses and Deploys CEVA's 802.11ac Wi-Fi IP in its Smart Home Access Point SoC
CEVA, Inc. announced that Shanghai SiFlower Communication Technology Co. Ltd. has licensed and deployed CEVA's RivieraWaves 802.11ac Wi-Fi IP in its latest ...
CEVA, Inc.
Oct 16, 2018
SVXR, Inc. announces sale of X200™ to SHIIMA Electronics Inc.
SHIIMA Electronics corporation will install the X200 in its Nirasaki, Yamanishi facility to facilitate adoption by their customers in Japan seeking to deliver the highest ...
Oct 16, 2018
The explosion of IR lighting applications is driving the growth of the IR light sources market
The development of new and smart functionalities in smartphone, medical and automotive applications as well as the development of breakthrough devices and functions ...
Yole Développement
Oct 15, 2018
Stamped Spring Pin Socket for 0.8mm pitch Infineon's LFBGA
Ironwood Electronics recently introduced a new socket addressing high performance requirements for Burn-in and Test applications - SBT-BGA-6553. The contactor is a ...
Ironwood Electronics
Oct 15, 2018
Indium Corporation to Feature Soldering Materials for HIA at IWLPC 2018
Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 15th Annual International ...
Indium Corporation