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Oct 25, 2017
EMS Launches Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Engineered Material Systems, Inc. is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level ...
Engineered Material Systems, Inc.
Oct 24, 2017
North American Semiconductor Equipment Industry Posts September 2017 Billings
North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in September 2017 (three-month average basis), according to the ...
SEMI
Oct 24, 2017
SHENMAO Exhibits at IWLPC
SHENMAO Technology. Inc. introduces New Generation Ultra Low Residue Liquid Flux SMF-WB51 with superior spray uniformity, excellent soldering performance and ...
SHENMAO Technology, Inc.
Oct 23, 2017
Stamped Spring Pin Socket for BGA293
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for Micro Controller Units - CBT-BGA-6071. The contactor is a stamped ...
Ironwood Electronics
Oct 23, 2017
Emerging 5G wireless communication standard is bringing disruption from services to technology and supply chain
The 5th generation of cellular networks is anticipated to arrive in the timeframe of the next 2-5 years, enabling Gbps datarates and a plethora of new applications ...
Yole Développement
Oct 20, 2017
Technic Releases Elevate® Cu 2000
Technic announces the introduction of Elevate®Cu 2000, an innovative, high-speed acid copper plating system specifically formulated for Fan-Out Wafer Level ...
Technic
Oct 20, 2017
New SEMI Market Research Report: China IC Industry Outlook
SEMI announced its new China IC Industry Outlook Report, a comprehensive report for the electronics manufacturing supply chain. With an increasing presence ...
SEMI
Oct 20, 2017
VERMES Microdispensing opens new Premises in Malaysia
VERMES Microdispensing announced it has opened its new corporation, VERMES Microdispensing Sdn Bhd, in Penang state, Malaysia. With this move the German-based company ...
VERMES Microdispensing
Oct 19, 2017
Holst Centre, imec and Philips demo world's first curved, plastic photodetector
Researchers from Holst Centre, imec and Royal Philips have produced the first ever prototype of a curved photodetector on a plastic substrate. The breakthrough paves ...
Holst Centre
Oct 19, 2017
ams audio chips offer noise-cancelling performance in two new wireless headphones
ams announced that headphone manufacturer FIIL is using two ams chipsets in its latest releases. ams' hybrid Active Noise Cancellation (ANC) audio IC, the AS3435 ...
ams AG