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Feb 13, 2018
imec Announces new CMOS Chip and Bluetooth Transceiver at ISSCC 2018
Imec has designed and fabricated a 16,384-electrode, 1,024-channel micro-electrode array (MEA) for high-throughput multi-modal cell interfacing. The chip offers ...
Feb 13, 2018
Applied Materials Named One of the World's Most Ethical Companies for 2018
Applied Materials, Inc. announced that it has been recognized by the Ethisphere Institute, a global leader in defining and advancing the standards of ethical business ...
Applied Materials
Feb 12, 2018
Brooks Instrument to Present New Mass Flow Controller at CSTIC and SEMICON China
Brooks Instrument will showcase its newly enhanced GF125 mass flow controller (MFC) with high-speed EtherCAT® connectivity and embedded self-diagnostics at ...
Brooks Instrument
Feb 12, 2018
Meyer Burger's SmartWire Connection Technology to play a role in REC Group's solar module technology
Meyer Burger Technology Ltd announced the successful conclusion of an important contract with REC Group, the largest European brand for solar panels, for its innovative ...
Meyer Burger
Feb 9, 2018
Leti Chief Scientist Barbara De Salvo Will Help Kick Off ISSCC 2018 with Opening-Day Keynote
Leti Chief Scientist Barbara De Salvo will help kick off ISSCC 2018 with an opening-day presentation calling for radically new, digital-communication architecture ...
Feb 9, 2018
Annual Silicon Volume Shipments Remain at Record Highs
Worldwide silicon wafer area shipments in 2017 increased by 10% against 2016 shipments, while worldwide silicon revenues rose by 21 percent over 2016 levels ...
Feb 8, 2018
Indium Corporation Senior Product Manager to Present at APEC 2018
Indium Corporation's Andy C. Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will present at APEC 2018, March 4-8 ...
Indium Corporation
Feb 7, 2018
Henkel and Holst Centre continue collaboration
Henkel and Holst Centre today announced the extension of their fruitful longterm collaboration, which focuses on developments related to health patch technologies and products. ...
Holst Centre
Feb 7, 2018
Leti Presents Optical-Equipment Curving Technology that Improves Performance, Cuts Costs
Leti has developed a new curving technology for optical sensors and micro-displays that improves performance, enhances field of view and compensates for aberrations ...
Feb 6, 2018
BGA SMT Emulation Adapter Set Allows Affordable, Reliable Socketing of Xilinx FF1153 ICs
Ironwood Electronics is introducing SF-BGA1153A-B-42F and LS-BGA1153A-41 BGA SMT adapter set, a low cost and reliable socket for Xilinx 1153 pin BGA ICs. The adapter ...
Ironwood Electronics