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Oct 4, 2018
Winbond starts constructing new 12-inch fab
Winbond Electronics will hold a groundbreaking ceremony for its new 12-inch wafer fab in southern Taiwan on October 3, according ...
Digitimes
Oct 3, 2018
ASE Gearing Up for FOPLP
Advanced Semiconductor Engineering (ASE) under ASE Technology Holding is expected to make significant progress on its fan-out panel-level packaging (FOPLP) ...
Digitimes
Oct 3, 2018
Tracking the Changing OSAT Market
Outsourced Semiconductor Assembly and Test (OSAT) service providers experienced strong growth in 2017, but will this growth continue? In the ...
SEMI
Oct 3, 2018
SEMI Calls for Exclusion Process for Products in New China Tariff List
Last week, SEMI joined a coalition of business groups in calling for Ambassador Robert Lighthizer, U.S. Trade Representative, to enact ...
SEMI
Oct 3, 2018
Foxconn commits support for chipmaking industry in Shandong
Foxconn Electronics has teamed up with China's Jinan municipal government to set up an investment fund to boost the local ...
Digitimes
Oct 3, 2018
Apple hardware-centric policy may no longer be viable
With sales of a series of Apple's products including the iPhone, MacBook, iMac, Apple TV, iPad and HomePod having fallen ...
Digitimes
Oct 3, 2018
Manufacturing Bits: Oct. 2
The Fraunhofer Institute for Applied Optics and Precision Engineering has developed a critical technology to enable quantum satellites. Fraunhofer has ...
Semiconductor Engineering
Oct 3, 2018
Samsung Electronics third-quarter profit seen at record, but peaking, as chips shine
Samsung Electronics Co Ltd is set to post a hefty jump in third-quarter profit to record levels after its chip ...
Reuters
Oct 3, 2018
3D VLSI is the New Active Interposer
3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on ...
3D Incites
Oct 3, 2018
Through-Silicon Transistors Could Make Stacking Chips Smarter
Through-silicon vias (TSVs) are the standard way to stack chips these days. They're basically micrometer-scale vertical wires embedded in a ...
IEEE Spectrum