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Jun 28, 2018
Transforming the Fan-out Landscape
These days, the first thing that comes to mind when someone mentions fan-out (FO) technology is Apple's A10 processor built ...
3D Incites
Jun 28, 2018
Market And Tech Inflections Ahead
Synopsys Co-CEO Aart de Geus explains why systemic complexity will be the next big challenge, and what that means for ...
Semiconductor Engineering
Jun 28, 2018
5G roundup: hunkered down to get it done
The major wireless carriers and their vendors have deadlines for deploying upgraded 4G and true 5G services in mere months. ...
EDN
Jun 28, 2018
ChipMOS seeing COF packaging capacity run at full utilization
ChipMOS Technologies has seen its COF (chip-on-film) packaging production capacity run at full utilization, thanks to strong demand for TDDI ...
Digitimes
Jun 28, 2018
Where Do FPGAs Stand in Auto IC Race?
While AI processors and AI-ready SoCs are getting all the attention from the investment community because they are deemed critical ...
EE Times
Jun 28, 2018
A Path to Broad AI: 5 Challenges
Try to find a technology conference or trade show where everybody is not talking about artificial intelligence. Go ahead: Try. ...
EE Times
Jun 28, 2018
DARPA Unveils $100M EDA Project
The U.S. will pour $100 million into two research programs over the next four years to create the equivalent of ...
EE Times
Jun 28, 2018
Leti Developing Low-power Network for IoT
European research institute Leti has carried out field trials of a new low-power wide-area (LPWA) technology, a waveform tailored for ...
EE Times
Jun 28, 2018
S. Korea semiconductor exports to reach $125 bln this year
South Korea's semiconductor exports are expected to jump 28% in 2018 from a year earlier on robust demand for memory ...
Yonhap News Agency
Jun 27, 2018
Wafer Prices to Spiral Upward Through 2025
Global supply of silicon wafers will remain tight and their prices are expected to spiral upward probably through 2025 due ...
Digitimes