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Jan 15, 2014
Dave Tacelli, Chief Executive Officer and President, LTX-Credence
After a difficult 2013, we are optimistic that 2014 will represent a growth year for the industry. The macroeconomic indicators are moving in a positive direction and since our industry relies heavily on the consumer, a strengthening global economy should translate to higher purchases of electronics. This should lead to a growth year for the semiconductor industry and therefore our served industries ...
Jan 14, 2014
Mayson Brooks, SVP Worldwide Sales & Field Operations, Rudolph Technologies
The continuing transition in consumer electronics to mobile technologies is increasing the drive of miniaturization in the semiconductor industry. Three dimensional integrated circuits (3DIC) and advanced packaging technologies are important new technologies that operate "More than Moore" to increase computing density by means other than reducing the size and number of transistors. Both approaches require ...
Jan 13, 2014
Michael S. Boger, Global Market Sector Manager, Edwards
Semiconductor manufacturers will continue to move toward the use of more complex packaging technologies as they strive to put greater power and functionality in less space. The trend to increasing complexity and 3D processing can be considered one of the "More than Moore" trends referenced in the International Technology Roadmap for Semiconductors. New packaging processes are expected to increase the use of ...
Jan 10, 2014
Chris Henderson, President, Semitracks
The semiconductor assembly and test market continues to grow in complexity. The introduction of numerous new packaging materials and the explosion of packaging formats have created a number of issues in packaging, including the need for better matched materials, methods for dealing with structures like copper pillars, TSVs, and stacked packages, new characterization techniques, and extensive reliability modeling ...
Jan 9, 2014
Joseph Sawicki, Vice President & General Manager, Mentor Graphics Corp.
In the area of 3D-IC packaging, although we continued to see a handful of interesting design releases, and even more customer evaluations, this past year, it seems like companies are still trying to determine which products will benefit the most from pursuing 2.5D-IC/3D-IC configurations. Cost is the major stumbling block at this point, not technical issues. Memory on memory, image sensor on logic, MEMs on logic, and memory on SoC/CPU/GPU/FPGA ...
Jan 8, 2014
Denny McGuirk, President and CEO, SEMI
After two years of decline, the 2014 wafer fab equipment market is expected to grow over 30%. Taiwan will spend the most, while Korea and the Americas will each spend about $4 billion. Spending in 2014 is expected to be slightly below 2011 levels--$39.5 billion for 2014 vs. $39.7 billion for 2011. The recent update of the SEMI World Fab Forecast predicts that fab equipment spending will decline about 9% in 2013 ...
Jan 6, 2014
Leo Linehan, Global Business Director, Dow Electronic Materials
Dow offers enabling materials at the chip, package and board levels, allowing the company to address the immediate needs of its customers as well as to anticipate changes that may affect customers several steps further along the supply chain. Packaging is a particularly interesting space to be in right now, as it's growing and driving the industry at large. Increased functionality relies more and more heavily on packaging and Dow's enabling materials. Driven by mobile ...
Jan 6, 2014
Brian Schmaltz, Western Area Sales Manager, NAMICS Technologies Inc.
"Low cost" will be the key words of 2014 as technology continues to expand into markets overseas. Cost vs. Functionality will battle becoming the driving factor towards tablet and smartphone expansion. In some cases conceding functionality for cost, but also pushing the envelope with expensive state-of-the-art manufacturing techniques in others. New smartphone / tablet hardware designs tailored to a consumers ...
Feb 22, 2013
Eric Roiter, President, M.E. Baker Company / Baker Solar Inc.
Baker's outlook for 2013 is quite optimistic in new markets, particularly in clean tech where our sales are especially robust. Our new FlexTool and BCM product lines for the solar PV and e-waste recycling industries, respectively, represent a significant portion of our top line growth for this calendar year. We have installed, and continue to install, a number of FlexTools in the United States and Europe for next-generation PV cell ...
Feb 21, 2013
Shimon Dahan, CEO, RED Micro Wire (RMW)
2012 has been a good year for RED Micro Wire, and we expect 2013 to be even better. In this past year, RED Micro Wire won a Red Herring award, recognizing us as one of the top 100 most promising and innovative technology companies in the world. During 2012 our engineers prepared our unique, glass coated micro bonding wire, getting it ready for release to customers in 2013. In 2013, RED Micro Wire will begin to ship our RED ...