We search for industry news, so you don't need to.
Press Releases arrow   Page 12 of 499   arrow
Submit a Press Release
Aug 16, 2018
SEMI Integration of ESD Alliance Underway
SEMI announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner. Full integration ...
Aug 16, 2018
Testing of LED Devices with Superior Temperature Performance in High Volumes
The Xcerra MT9510 XP pick-and-place handler successfully passed the onsite buy-off for an automotive LED test application at a leading lighting manufacturer. ...
Xcerra Corporation
Aug 14, 2018
TRI to reveal 3D Micro Components Inspection Solutions at SEMICON Taiwan
Test Research, Inc. (TRI) will join SEMICON Taiwan 2018. TRI will showcase state-of-the-art 3D Automated Micro SMD Inspection Solutions. SEMICON Taiwan will be held ...
Test Research, Inc. (TRI)
Aug 14, 2018
UltraSoC selects MosChip to support its growth in India
UltraSoC announced that it has appointed MosChip as its technical sales representative in India, as part of a program to support the rapidly developing global market ...
Aug 14, 2018
Carl Zeiss Meditec accelerates growth
After nine months 2017/18, Carl Zeiss Meditec AG was able to achieve further encouraging growth in all strategic business units and regions: Revenue increased by 7.1% ...
Aug 13, 2018
CyberOptics to Demo Airborne Particle & MRS Sensors at SEMICON Taiwan
CyberOptics® Corporation announces it will demonstrate its next generation Airborne Particle Sensor™ technology (APS3) 300mm with new ParticleSpectrum™ software ...
CyberOptics® Corporation
Aug 13, 2018
Xcerra introduces HSI1x 12.8 Gbps SerDes test instrument
The new Xcerra HSI1x instrument for the well-established Diamondx platform features 32 transmit lanes and 24 receive lanes with up to 12.8 Gbps data rate. The instrument...
Xcerra Corporation
Aug 10, 2018
High Thermal, Semi-Sintering Die Attach Paste a Breakthrough for Emerging Package Performance Requirements
Henkel has developed and commercialized a novel series of die attach materials to facilitate package-level sintering, addressing the regulatory challenges of high-lead solders, thermal ...
Henkel Electronics Materials, LLC
Aug 10, 2018
ZESTRON Academy FREE Stencil, Underside Wipe and Misprint Cleaning Webinar
ZESTRON is pleased to announce that it will host the "Stencil, Underside Wipe and Misprint Cleaning" webinar on Thursday, August 30th, from 1:30 PM to 2:30 PM EDT. This ...
Aug 10, 2018
ClassOne Places Flagship Solstice® CopperMax™ with i3 Microsystems
ClassOne announced the sale its flagship Solstice® CopperMax™ electroplating tool to i3 of Binghamton, NY. i3 is rapidly expanding its St. Petersburg, FL facility to accommodate ...