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Jun 6, 2018
27 GHz Bandwidth Open Top Socket for BGA240
Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch, 240 pin BGA IC's. The SG-BGA-6475 socket is designed for IC size - 17x18mm ...
Ironwood Electronics
Jun 6, 2018
Imec Extends Damascene Metallization Towards the 3nm Technology Node
At this week's 2018 IEEE International Interconnect Technology Conference (IITC 2018), imec will present 11 papers on advanced interconnects, ranging from extending ...
Imec
Jun 5, 2018
Worldwide Semiconductor Equipment Billings in First Quarter 2018 Reach Record $17.0 Billion
SEMI reported that worldwide semiconductor manufacturing equipment billings reached a historic quarterly high of US$17.0 billion for the first quarter of 2018 ...
SEMI
Jun 5, 2018
Plessey partners with Vuzix to develop next-generation AR Smart Glasses using microLED technology
Plessey Semiconductors announced it is partnering with Vuzix, a pioneer in the development of technologies for Smart Glasses. The two companies are partnering to ...
Plessey Semiconductors
Jun 5, 2018
A MEMS market showing a 17.5% 2018-2023 CAGR and strongly supported by current mega trends
"MEMS market will experience a 17.5% growth in value between 2018 and 2023, to reach US$ 31 billion at the end of the period," asserts Dr. Eric Mounier, Principal ...
Yole Développement
Jun 4, 2018
Mycronic acquires MRSI Systems, LLC
Mycronic AB (publ), acquires 100% of MRSI Systems, LLC (MRSI), headquartered in North Billerica, Massachusetts, in the USA. The purchase price amounts to USD 40.7 million ...
MRSI Systems, LLC
Jun 4, 2018
Imec demonstrates efficient cost-effective cooling solution for high performance chips
Imec announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level. This achievement is an important ...
imec
Jun 4, 2018
Top VCSEL Makers Choose ClassOne Plating Systems
ClassOne Technology has announced the sale of its Solstice¬ Electroplating Systems to the industry's leading providers of VCSEL devices in recent months. The announcement ...
ClassOne Technology
Jun 1, 2018
The advanced packaging industry is on the move
Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the ...
Yole Développement
Jun 1, 2018
New XRF Instrument Measures the Smallest Features in Semiconductor / Microelectronics Manufacturing
Bowman has introduced a new instrument for the smallest features in semiconductors and microelectronics. Bowman's W Series uses poly-capillary optics to focus the ...
Bowman