Henkel Webinar: Integrated Advanced Underfill Solutions
Henkel Webinar: Integrated Advanced Underfill Solutions

Dear Valued Customer,

I would like to invite you to our upcoming live webinar on "Integrated Advanced Underfill Solutions" presented by our technical experts Judy Ermitano and Rose Guino.

You will have the chance to raise questions and to discuss with our experts directly after the presentation.

Please take advantage of this opportunity - save the date and register with the links below:

Henkel Webinar: Integrated Advanced Underfill Solutions
"Integrated Advanced Underfill Solutions"

Judy Ermitano, Market Development Manager
Rose Guino, Technical Service Engineer

Session 1 (Americas / EIMEA)
Date: Wednesday, November 11, 2015
Time: 7:00 - 7:45 AM PDT / 4:00 - 4:45 PM CEST

Session 2 (APAC) :
Henkel Webinar: Integrated Advanced Underfill Solutions
Date: Thursday, November 12, 2015
Time: 10:00 - 10:45 AM CST
Presentation Summary:

Over the past decade, we have seen a significant growth in the mobile computing market that propelled the adoption of various interconnection solutions. As further transistor scaling becomes challenging and costly, companies are turning to advanced packaging technologies, to continue the path towards performance and functionality boost in support of market demands.

Mobile technology will remain to be a key driver in the electronics industry. The trend for smaller form factors, higher I/O count for increased density and performance, and lower cost of ownership will push forward alternative solutions requiring innovative materials that enables the next generation packages.

In this webinar, we will cover Henkel's broad range of underfill solutions including Capillary Underfill (CUF), Non Conductive Paste (NCP), and Non Conductive Film (NCF). These materials were developed to support current and future flip chip interconnect technology across different market segments. Fine pitch Cu Pillar with lower gap, thin die processing and stacking, tight KoZ for high density substrate designs and robust reliability performance are important considerations in our material design.

Kind regards,

Judy Ermitano

Market Development Manager
Henkel Adhesive Electronics

For further information about our webinar sessions, please visit our webinar website: www.globalhenkelelectronics.com/webinars

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