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Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.

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  Dynaloy Cleaning Solutions
Semiconductor Applications
Dynaloy Cleaning SolutionsDynaloy develops, manufactures and markets world class advanced cleaning solutions for semiconductor and specialty applications including wafer level packaging and micro-electronics. Learn more…
Dynaloy LLC
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July 2, 2009

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Versatility Equals Value: Multi-Application Bonder
White Paper Download
Multi-Application BonderEquipment that offers bonding application flexibility in one platform provides value in today's challenging times. Download this white paper to learn more…
Finetech

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On This Day
July 2, 1985 - The first version of Microsoft Windows was shipped.


White Paper: Photo Resist coating
Precision coating with Ultraspray Technology
Photo Resist WPOutlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper…
Ultrasonic Systems, Inc.

Cartoon of the Day
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"Do you want my answer in school math or corporate math?"
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Top Story  
IC market 'surge' at hand, says analyst
The second half of 2009 will bring welcome relief to the semiconductor and capital equipment industries, according to market research firm IC ...
EETimes

Control Costs and Maximize Yield
Discover the XD7600NT
Dage Precision Industries CTIf you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. Learn more…
Dage Precision Industries
Industry News  
Analysts see upbeat third quarter in store for chips
Despite lingering concerns about the tech market, chip manufacturers are poised for a generally upbeat third quarter. The positive outlook coming ...
Market Watch
Foxconn says it's not quitting the channel
Speculations about Foxconn quitting the channel are false says the company's sales team, hitting back as rumours of the firm's channel demise ...
The Inquirer
NEC Electronics Expects Orders to Climb Next Quarter
NEC Electronics Corp.’s semiconductor orders will increase "several percent" next quarter, helped by demand for chips used in cars and ...
Bloomberg
SIA Supports Call For Caution In Changes To Int'l Tax Rules
The Semiconductor Industry Association gave strong support to the New Democrat Coalition’s call to avoid tax changes that could damage the ...
Semiconductor Industry Association
New Greenpeace guide lauds Apple, attacks PC makers
Large PC builders are dragging their feet when it comes to environmental promises, claims Greenpeace. The activist group has once again updated ...
Electronista
Rambus claims 'world's fastest memory'
Rambus, a technology licensing companies specialising in high-speed memory architectures, has demonstrated its XDR memory system running at data ...
Electronics News
Is FPGA startup CSwitch dead?
FPGA startup CSwitch Corp. appears to have closed its doors, according to several industry sources, including one of the third-party sales ...
EETimes
Small-size driver IC price likely to be raised in July
Taiwan small-size driver IC makers have said they may raise product prices in July at the earliest to reflect the costs. The backend production ...
Digitimes

F&K Delvotec G5 Heavy Ribbon Bonder
The Worlds only fully convertible Bonder
Bonding & TestingF&K Delvotec provides an incredible ROI by offering a Heavy Ribbon Bonder with 30-minute convertibility to fine wedge, heavy wedge, fine ribbon, ball bonding, or deep access. With the G5 you simply retrofit a compact bond head for less than $20k. Learn more…
F&K Delvotec
Technology News
Low-Power Design Site Aids Green Engineering
Off-Chip Communications LLC has launched the online engineering magazine, blog and forum http://www.low-powerdesign.com, a portal catering to the ...
PR Newswire
New family of LED drivers support small LCD screens
Diodes Incorporated has introduced a family of three new LED drivers that provide a cost-effective and small form factor solution for small ...
EETimes
QuantaSol touts efficiency of single-junction solar cell
QuantaSol Ltd., a developer quantum-well based photovoltaic technology and spinoff from Imperial College, London, has developed what it says is ...
EETimes

MEMS Innovation
Growth Engine in Rich and Lean Times
Packaging DevelopmentsJoin MEPTEC on May 14, 2009 for the 7th annual MEMS Symposium to explore the new innovations, enabling technologies, and emerging applications that continue to drive growth through the recession and into a promising new future. Learn more…
MEPTEC
Corporate News Submit
DEK Solar adds another bright spark to its global Alternative Energies team
DEK Solar continues its commitment to illuminating the solar energy sector following the announcement that Robin Bancroft has joined its ...
DEK Solar
Michelle Shakespeare-Martin at Panasonic Industrial Company
Panasonic has introduced two new metal oxide semiconductor field effect transistors (MOS FET) with outstanding performance characteristics ...
Panasonic

White Papers Submit
Jun 15, 2009    Hermetic Sealing Using Low Impedance Projection Welding
Jun 1, 2009    Resist Removal Solutions in Advanced Packaging Applications
May 7, 2009    Breakthrough Package-Level Lead-Free Alloy

Calendar Submit
Jul 2, 2009    Innovation in Processing at the Nanoscale
Jul 12, 2009    North America Standards Meetings at SEMICON West 2009
Jul 13, 2009    2009 International Workshop on EUV Lithography
Jul 13, 2009    Insider's Guide to Business Strategy for the MEMS Industry
Jul 13, 2009    Fundamentals of Semiconductor Optoelectronics and Photonics

Most Popular Most read news from the past few days.
Jul 1, 2009    Sales of iPhone to Benefit Taiwanese IC Chip Industry
Jul 1, 2009    Sony reveals $2,000 netbook
Jun 30, 2009    Amkor’s James Kim to leave CEO role, Ken Joyce to take over
Jun 30, 2009    Teardown reveals thin profit margin on Mac Mini
Jun 29, 2009    Exec: Memory business model is broken
Jun 29, 2009    Collaboration, manufacturing innovation vital for next-generation foundries
Today's Sponsor


Ultra Precision Micro Assembly
and High Performance Dispensing
Air-Vac DRS24Unique Benchtop or Cell Systems with flexible design, can be configured to your specific application requirements, learn morelearn more…
Air-Vac Engineering


Improve Your Uptime
High Precision Dispense Tips
Precision needlesThe DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology

Quote of the Day
"There is no reason for any individual to have a computer in his home."
Ken Olsen


Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.

Test Your Knowledge
What is the male part of a flower called?
Answer: The stamen

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