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  New Fully Automatic Heavy Wire Bonder
Increases Productivity by 30%
wire bonding in actionProcess aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more…
Hesse & Knipps, Inc.
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Microliter dispensing made easy with PCD Volumetric dispense valve
PCD TechnologyUnmatched volumetric repeatability at 1microliter volumes. Viscosity from water to thick pastes, the value does not require day to day calibration. PCD controller for worktable or integration to system. Learn more…
GPD Global




Lead-Free package level alloys
New White Paper
Full Wafer Die Attach White PaperNot all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications. A new breakthrough package level lead-free alloy addresses board-level alloy challenges. Click to download paper…
Henkel Corporation
  Corporate News Index
May 16, 2008

ZESTRON America to Announce New North East Sales Manager

Manassas, Va. – ZESTRON America is pleased to announce the addition of Mr. Neil Murphy as North East Sales Manager. In his role, Murphy will be responsible for growing ZESTRON’s product and service business while expanding the current customer base in the North East region. “Murphy is a tremendous addition to our global team,” said Mr. Mike McCutchen, National Sales Manager of ZESTRON America. “This strategic addition to our staff further demonstrates the commitment to our expanding operations in the Americas.”

Mr. Neil Murphy received his Bachelor of Science from the University of Massachusetts. With more than twenty eight years of sales and technical experience in the electronic and semiconductor manufacturing industry, Neil Murphy will be able to immediately support ZESTRON’s current and future customers in the North East region.

Contact:
ZESTRON

Sylvain Chamousset
http://www.zestron.com

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Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
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