We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers May 9, 2008 Register today for International Wafer Level Packaging Conference 4 days, 3 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here! SMTA Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why... Juki Corporation Letters Submit On the fly Dispense Process Verification GPD Global's Process View Camera provides operators instant feedback. Operators confidently monitor processes at the dispense tip from across a production floor. Setup operators can view the dispense tip for quick parameter adjustment, reducing setup time and costs for new projects. Learn more … GPD Global Top Story   Actual data shows March global chip market up 7.3% The global market for semiconductors was $25.51 billion in March according to data from World Semiconductor Trade Statistics (WSTS), ... EETimes Vapor Phase Soldering White paper Download Wafer bumping and package attach becomes more complex with lead free alloys. Vapor Phase provides an Oxygen free, 0 deg delta T alternative to conventional thermal systems. Download this white paper to learn more. A-Tek LLC Industry News   Third-Party DRAM Module Market to Rebound in 2008 Following a miserable 2007, the global DRAM module market is expected to rebound gradually in 2008 due to the projected recovery in the overall ... iSuppli Corporation Who will buy Jazz Jazz Technologies Inc., which is on the block, has yet to announce a buyer. Earlier this year, foundry specialist Jazz said that it had ... EETimes Vietnamese IC-assembler moves forward Vietnam-Chipscale Advanced Packaging Services (V-CAPS) has obtained its ''investment certificate'' from the Vietnamese government ... EETimes Wireless chip industry consolidation The rising cost of developing wireless chips will mean that there will have to be further consolidation in the wireless chip industry, ... Electronics Weekly Taiwanese semiconductor firms prepare to storm China A Semiconductor quarterly report reckons liberal Taiwanese investment policies will cause an exodus of lower-profit production over to ... The Inquirer India Sees 21.7% Annual Growth in Semiconductor Design, Embedded Software The India Semiconductor Association (ISA), a trade group representing the Indian semiconductor industry, and IDC (India) Ltd launched ... Tech On Brooks Automation Reports Second Quarter Financial Results Brooks Automation, Inc. announced financial results for the Company's second quarter and first six months of fiscal 2008. Revenues for the ... CNN Money Xbox 360's 65nm Jasper chipset in the works for August release? While our primary gripe with the 360 continues to be drive noise, any improvements to the console that might subdue the impression it's ... Engadget Wafer Shipments Flatten in Q1 Worldwide silicon wafer area shipments remained essentially stable in the first quarter of 2008, marginally declining 1% sequentially, ... Circuits Assembly Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Technology News   Light/Matter Interaction to Improve Semiconductor Interfaces Research carried out at North Carolina State University (Raleigh) on the interaction of light with matter promises a better understanding of ... Semiconductor International Are solid-state disks going mainstream? Technology has been making progress rapidly in all sectors of the IT world in the last decade. Perhaps arguably none more quickly than ... Computerworld Malaysia Tech firms' millions get them a muddle on patent bill After an intense struggle that's cost more than $3.5 million in lobbying fees, a coalition of technology giants Cisco Systems Inc., Google ... Market Watch Modern ceramics help advance technology Many important electronic devices used by people today would be impossible without the use of ceramics. A new study published in the ... PhysOrg Ultra-fast laser goes searching for planets Planet-searching capabilities got a 100-fold boost recently. A new ultra-fast, ultra-short-pulsed laser configured as a "gap-toothed" ... EETimes Scientists demonstrate method for integrating nanowire devices directly onto silicon The basic structure of the nanowire devices is based on a sandwich geometry in which a nanowire (n-type zinc oxide) is placed between ... PhysOrg Handsets with dual MEMS microphones to hit market in 1Q09 Handsets with dual MEMS (micro electro-mechanical systems) microphones from the world's top-five handset vendors are expected to hit the ... DigiTimes An AOI that finds all defects Improve quality and yield of production Technology for inspecting includes: Thickfilm, Thinfilm, LTCC, Adhesive, Overglaze, Solar Cells, Gold (Printed, plated), All printed or electroplated Layers. Learn more by clicking … EPP Corporate News Submit Third-Party DRAM Module Market to Rebound in 2008 Following a miserable 2007, the global DRAM module market is expected to rebound gradually in 2008 due to the projected recovery in the ... iSuppli Corporation Leaders in 3D Announce Seminar Series in North America The highly successful 2007 3D Integration Roadshow in Asia has now reached North America. It is scheduled to take place in Durham, NC, ... 3D Integration Roadshow Today's Sponsor Wanted…For Ruining your Production The $10 counterfeit component Success begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper… Dage Precision Industries Desire for Two in One? Datacon Multi-Chip Die Bonder2200 evo! Dispenser, die attach unit and flip chip unit in one module! An accuracy of10µm@3s at highest through-put of up to 7,000 UPH! 2200 evo: ultimate flexibility and best cost of ownership. Learn more… Datacon Technology GmbH Asymtek's SV-100 Slider Valve Faster Solder Paste Dispensing Up to 20% faster than standard auger dispensers, the SV-100 achieves 20,000, 300 micron dots per hour and can selectively dispense into small and hard to reach places where it is difficult to screen print. See more… Asymtek Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Event Calendar White Papers Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. 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