The highly successful 2007 3D Integration Roadshow in Asia has now reached North America. It is scheduled to take place in Durham, NC, Dallas, TX and San Jose, CA on May 12, 14 and 15, respectively.

Key topics being addressed are photolithography, etch and fill materials and processes for through silicon vias (TSV), as well as thin-wafer handling, temporary bonding, and materials associated with these technologies. Leading edge, total process solutions for 3D wafer level packaging will be demonstrated by combining the expertise of STS in deep reactive ion etch (DRIE) for via fabrication, NEXX Systems in PVD and electrodeposition for lining and filling of vias and SUSS MicroTec in wafer bonding and photolithography. Additionally, users from leading chip fabricators and technology providers will address such issues as market drivers, process sequences and application opportunities for 3D technology. More detailed information is available at: www.3dintegration.org/usa.

About Surface Technology Systems plc: STS is a leading provider of specialist plasma etch and deposition systems to customers in the MEMS, wafer level packaging, optoelectronic, compound semiconductor, and thin film head industries. Additional information can be found at: http://www.stsystems.com/ .

About SUSS MicroTec: SUSS MicroTec is one of the world’s leading suppliers of process and testing solutions for markets such as advanced packaging, MEMS, nanotechnology, compound semiconductor, Silicon-On-Insulator and 3D Interconnect. SUSS MicroTec enables its customers to increase process performance while reducing cost of ownership and to meet the volume requirements of fast growing markets with high quality solutions. Additional information can be found at: http://www.suss.com/.

About NEXX Systems: NEXX Systems brings exceptional technical expertise to flip chip and advanced packaging. Our product lines provide the most efficient, yet affordable, systems of their kind: Nimbus for multi-layer sputter deposition of metals, and Stratus for high throughput electro-deposition of metals. Additional information can be found at: http://www.nexxsystems.com/.