We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers May 8, 2008 Register today for International Wafer Level Packaging Conference 4 days, 3 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here! SMTA Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why... Juki Corporation Letters Submit On the fly Dispense Process Verification GPD Global's Process View Camera provides operators instant feedback. Operators confidently monitor processes at the dispense tip from across a production floor. Setup operators can view the dispense tip for quick parameter adjustment, reducing setup time and costs for new projects. Learn more … GPD Global Top Story   IC packaging houses looking to copper due to high price of gold Taiwan-based IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) as well ... DigiTimes Does your reflow offer guarantees? Ours Does • Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more… ATEK Systems Group Industry News   Flip Chip Goes 3D Current 3D packaging solutions involve a mix of high density circuit boards with stacked ICs using wire bond interconnect. With advances ... Advanced Packaging Wafer shipments steady in first quarter '08 Shipments of silicon wafers worldwide declined by 1 percent during the first quarter of 2008 compared to the last quarter of 2007 according ... EETimes Package-on-Package Variations On the Horizon Improvements to both the surface-mount process and PoP assembly process and materials set are becoming necessary as the industry embarks on ... Semiconductor International Chip designers should collaborate With technology and economics becoming inseparable in the present-day consumer-driven market, the movers-and-shakers of the semiconductor ... Business Standard Solar Semiconductor ties up with US cell maker Motech Solar Semiconductor, a rapidly growing producer of high quality photovoltaic (PV) modules, on Wednesday announced a strategic ... Economic Times IBM, TSMC Land Orders to Manufacture 65nm Chips for Microsoft Xbox 360 Microsoft Corp. reportedly plans to release a new version its Xbox 360 video game system code-named Jasper in August and has already ... X-bit Labs Indian semiconductor ecosystem changing, panelists say Top executives from the Indian and global chip industry think the semiconductor ecosystem in the country is poised for takeoff. But ... EETimes Qualcomm, Foxlink partner to open dedicated mirasol MEMS fab Qualcomm MEMS Technologies, Inc. and Cheng Uei Precision Industry Co., Ltd. announce an agreement to open a new, dedicated fabrication plant ... Small Times Silicon shortage prompts photovoltaic industry changes Booming global demand for solar energy has spurred a critical shortage of polysilicon used to make Photovoltaic (PV) cells, causing PV suppliers ... Engineer Live AMD discloses 12-core server chip Advanced Micro Devices disclosed a conservative road map for 45nm server processors using six and twelve cores through 2010. Lifting a page ... EETimes SEMI: Wafer shipments flat in 1Q08 Worldwide silicon wafer area shipments were roughly the same in 1Q as they were in 4Q, reflecting the industry's overall conservative ... Solid State Technology Axcelis Announces Financial Results for First Quarter 2008 Axcelis Technologies, Inc. (announced financial results for the first quarter ended March 31, 2008. The Company reported first quarter ... Prime Newswire Samsung blasts into top ten foundries list Samsung Electronics delivered 413% revenue growth in chip production in 2007, according to researchers at IC Insights. Only three of the top ... The Inquirer Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Technology News   Demystifying the memristor Researchers at HP Labs have solved a decades-old mystery by proving the existence of a fourth basic element in integrated circuits that ... Labs HP 3-D Interconnections On the Rise The chip has been unchallenged as the ultimate form of electronic circuit integration since the invention of the IC. The rate of ... Semiconductor International Haze, Still Misunderstood, Costing Industry $1B a Year Arguably the single largest yield detractor in the semiconductor industry, costing the industry about a billion dollars every year, ... Semiconductor International Producing efficient heat sinks Tomorrow’s coolants for electronic devices and engines would come from magnetic nanofluids. And scientists at the Indira Gandhi Centre for ... The Hindu An AOI that finds all defects Improve quality and yield of production Technology for inspecting includes: Thickfilm, Thinfilm, LTCC, Adhesive, Overglaze, Solar Cells, Gold (Printed, plated), All printed or electroplated Layers. Learn more by clicking … EPP Corporate News Submit WaferTronix to supply wafer products & consulting services The beginning of May saw the launch of WaferTronix of Boca Raton, FL, USA. Founder and CEO Donald J. Capo said: "The company's mission is ... WaferTronix Hesse & Knipps Wedge Bonder Improves Cost-of-Ownership Hesse & Knipps will be demonstrating the capabilities of the BONDJET BJ820 at the upcoming International Microwave Symposium in booth 1149 ... Hesse & Knipps Dage wins distinguished Frost & Sullivan Award Dage Precision Industries is pleased to announce that it was recently awarded the prestigious Frost & Sullivan Vertical Market Penetration ... Dage Precision Industries Today's Sponsor Wanted…For Ruining your Production The $10 counterfeit component Success begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper… Dage Precision Industries Desire for Two in One? Datacon Multi-Chip Die Bonder2200 evo! Dispenser, die attach unit and flip chip unit in one module! An accuracy of10µm@3s at highest through-put of up to 7,000 UPH! 2200 evo: ultimate flexibility and best cost of ownership. Learn more… Datacon Technology GmbH Asymtek's SV-100 Slider Valve Faster Solder Paste Dispensing Up to 20% faster than standard auger dispensers, the SV-100 achieves 20,000, 300 micron dots per hour and can selectively dispense into small and hard to reach places where it is difficult to screen print. See more… Asymtek Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Event Calendar White Papers Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.