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YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
imageYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
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Hesse & Knipps PiQC
Process Integrated Quality Control
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  Industry and Technology News Index
May 9, 2008  -  Click the title to read the full article.

Xbox 360's 65nm Jasper chipset in the works for August release?
While our primary gripe with the 360 continues to be drive noise, any improvements to the console that might subdue the impression it's ...
Engadget
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Vapor Phase Soldering
White paper Download
imageWafer bumping and package attach becomes more complex with lead free alloys. Vapor Phase provides an Oxygen free, 0 deg delta T alternative to conventional thermal systems. Download this white paper to learn more.
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