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  Thursday, Sept 11, Baltimore, MD
Asymtek presents free
imagecoating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more…
Asymtek
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  Industry and Technology News Index
May 9, 2008  -  Click the title to read the full article.

Wafer Shipments Flatten in Q1
Worldwide silicon wafer area shipments remained essentially stable in the first quarter of 2008, marginally declining 1% sequentially, ...
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December 4, 2006 - Technology News
A primer on common packages and mounting methods.
0612techtipsfig1_001.gif

In most cases, an IC chip (die) is packaged into a plastic or ceramic enclosure, such as a quad flatpack, small outline package, or one of the newer BGA or ...

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Thursday, Sept 11, Baltimore, MD
Asymtek presents free
imagecoating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more…
Asymtek




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