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  Thursday, Sept 11, Baltimore, MD
Asymtek presents free
imagecoating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more…
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YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
imageYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech




Hesse & Knipps BONDJET BJ920
heavy wire bonder integrates pull and shear test
imageHesse & Knipps BONDJET BJ920 heavy wire bonder gives you speed, accuracy and the largest bonding area - it is also the only bonder with integrated pull and shear test. Learn more…
Hesse & Knipps
  Industry and Technology News Index
May 8, 2008  -  Click the title to read the full article.

Demystifying the memristor
Researchers at HP Labs have solved a decades-old mystery by proving the existence of a fourth basic element in integrated circuits that ...
Labs HP
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May 8, 2008 - Technology News
Demystifying the memristor
Researchers at HP Labs have solved a decades-old mystery by proving the existence of a fourth basic element in integrated circuits that ...
Labs HP
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Vapor Phase Soldering
White paper Download
imageWafer bumping and package attach becomes more complex with lead free alloys. Vapor Phase provides an Oxygen free, 0 deg delta T alternative to conventional thermal systems. Download this white paper to learn more.
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