International Microwave Symposium Booth 1149 

San Jose, CA – Hesse & Knipps, leading manufacturer of high-speed fine pitch wedge bonders for the back-end semiconductor industry, will be demonstrating the capabilities of the BONDJET BJ820 at the upcoming International Microwave Symposium in booth 1149 on June 15 – 20 in Atlanta, GA. The BONDJET BJ820 is a high-speed fully automatic wedge bonder that offers the flexibility for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform - including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive - using aluminum or gold wire or ribbon up to 6 wires/second. The looping profiles and height consistencies offered by the BONDJET BJB20 meet and exceed RF/Microwave Market expectations.

With high repeatability of 1ìm at a balanced encoder resolution of 20nm, the BJ820 BONDJEToffers increased process stability that enables reliable bonding of extremely small bond pads with a larger wire diameter. An efficient 12” x 16.1” work area can serve as two or more smaller stations for efficient handling of smaller products or substrates. Coupled with intelligent automation solutions, these features eliminate significant indexing time, resulting in 60% greater throughput than competing machines.

“The BONDJET BJ820 offers very high repeatability for high volume production environments and a large control work area for both wire and ribbon bonding, offering greater throughput than competitive technology,” notes Joseph Bubel, President, Hesse & Knipps, Inc. “It offers a cost effective alternative for ribbon bonding, which is gaining greater popularity for use in high frequency electronics within the microwave market.”

Other significant machine capabilities include:

• 12.5ìm to 85ìm diameter wire bonding
• Ribbon bonding from 6ìm x 35ìm to 25ìm x 250ìm
• Constant loop height and wire length
• Maintains parallel loops within mixed reference system
• Auto teach for linear applications, reducing programming time

2-2-2 Hesse & Knipps

With a footprint of only 720 x 1250 mm, the BONDJET BJ820 can be easily integrated into existing floor plan configurations or new concepts. For more information on the BONDJET BJ820, email us or refer to our web site.