We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers May 7, 2008 Register today for International Wafer Level Packaging Conference 4 days, 3 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here! SMTA Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why... Juki Corporation Letters Submit Improved Accuracy & Repeatability for the Dispensing Process GPD Global's backlit calibration station improves accuracy and repeatability in dispensing. Alignment of the dispense tip is enhanced by illuminating material dispensed during calibration from below, eliminating sheen from fluid droplets that cause errors in traditional vision alignment. Learn more … GPD Global Top Story   Samsung posts 413% growth in foundry revenues It may have been a lacklustre year in 2007 for revenue growth on the parts of TSMC, UMC and Chartered Semiconductor, but according to ... Fabtech Does your reflow offer guarantees? Ours Does • Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more… ATEK Systems Group Exclusive   Innovation and Collaboration around 3D Integration and Packaging I am always impressed when innovative companies collaborate with end users to share their knowledge and understanding with all of us. That will happen beginning next week when three leading equipment suppliers for the 3D Interconnect market will come together ... Steve DeCollibus, Managing Editor Semiconductor Packaging News Industry News   Mobile Handset Market Stays on Track in Q1 The global mobile-handset market in the first quarter of 2008 appeared to be unaffected by the economic slowdown, with shipments rising by a ... iSuppli Corporation Intel, Samsung, TSMC Plan Shift to 450-mm Wafers Intel, Samsung and TSMC agreed to develop 450-mm wafers for semiconductor manufacturing, timing the transition away from the current 300-mm ... PC Magazine ASIC specialist eSilicon expands strategy, seeks acquisitions After hitting a few speed bumps along the road, fabless ASIC vendor eSilicon Corp. appears to have regained its momentum and has expanded ... EETimes Did Apple invest in P.A. Semi prior to acquisition? Word on the street is that there is still a little more light to be shed on the saga of P.A. Semi and Apple. Readers will remember that the ... EETimes AMD says Intel paid PC makers to boycott rival Advanced Micro Devices has expanded the allegations in its antitrust suit against Intel, saying its larger rival paid computer makers not to do ... EETimes RF Micro to cut 350 jobs worldwide RF Micro Devices Inc. said yesterday that it is cutting 350 jobs worldwide with its decision to reduce its development of wireless ... Winston-Salem Journal $4.8b memory-chip plant delayed till next year The opening of a $3US.5 billion ($4S.8 billion) plant in Singapore to make cutting-edge memory chips has been delayed - the latest casualty ... Semiconductor International Qualcomm to build MEMS display plant Qualcomm Inc. is a fabless chip maker. Or is it? Qualcomm MEMS Technologies Inc., a subsidiary of Qualcomm, and Cheng Uei Precision ... EETimes SEMI: IC production value to lag behind shipments in 2008 Despite consistent demand growth for consumer electronics driving IC output, the downhill trend in average selling price (ASP) will result ... DigiTimes AMD to spin-off fab operations? Shares in Advanced Micro Devices Inc. (AMD) have climbed amid reports that the company will split itself into two parts, including the spin ... EETimes Samsung steams into foundry top ten, says IC Insights Samsung Electronics Co. Ltd. increased its foundry sales fivefold in 2007 to achieve $385 million in revenue and grab tenth spot in IC Insights' ... EETimes Tech firms will push for bigger silicon wafers Intel Corp., Samsung Electronics and Taiwan Semiconductor Manufacturing Co. announced this week that they will work together to spread the ... The Columbian AMD shares jump on restructuring optimism Advanced Micro Devices Inc shares jumped more than 12 percent on investor optimism that the beleaguered chipmaker could soon announce ... Reuters Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Technology News   Semiconductors to be even cheaper by 2012 The three amigos. Three of the world’s biggest semiconductor manufacturers have announced that they “have reached agreement on the ... HEXUS.channel Microchip Technology announces serial EEPROM family on new single I/O bus Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, has announced a new 10-member family of serial ... India PR Wire LDK Solar Signs a Five-Year Wafer Supply Agreement With Qimonda AG LDK Solar Co., Ltd. announced that it has signed a five-year contract to supply multicrystalline solar wafers to Germany-based Qimonda. Under the ... Greentech Media Chip heavyweights pin down 450mm date, tout "collaboration" Three of the world's top chipmakers -- Intel, Samsung, and TSMC -- have agreed on a due-date of 2012 to have a 450mm-wafer-capable pilot line ... Solid State Technology An AOI that finds all defects Improve quality and yield of production Technology for inspecting includes: Thickfilm, Thinfilm, LTCC, Adhesive, Overglaze, Solar Cells, Gold (Printed, plated), All printed or electroplated Layers. Learn more by clicking … EPP Corporate News Submit Photovoltaic Production, R&D Facilities to Open in China DuPont will soon begin construction on a research center in Hong Kong and a manufacturing facility in Shenzhen to support the rapidly ... DuPont Intel, Samsung Electronics, TSMC Reach Agreement For 450mm WAFER Manufacturing Transition Intel Corporation, Samsung Electronics and TSMC announced they have reached agreement on the need for industry-wide collaboration to ... Intel Corporation, Samsung Electronics and TSMC New 827-840 MHz VCO From Crystek Corporation Crystek's CVCO55CC-0827-0840 VCO operates from 827 MHz to 840 MHz with a control voltage range of 0.2V~4.7V. This VCO features a typical ... Crystek Corporation Today's Sponsor Counterfeit Components New white paper provides solutions Success begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper… Dage Precision Industries Desire for Two in One? Datacon Multi-Chip Die Bonder2200 evo! Dispenser, die attach unit and flip chip unit in one module! An accuracy of10µm@3s at highest through-put of up to 7,000 UPH! 2200 evo: ultimate flexibility and best cost of ownership. Learn more… Datacon Technology GmbH Asymtek's SV-100 Slider Valve Faster Solder Paste Dispensing Up to 20% faster than standard auger dispensers, the SV-100 achieves 20,000, 300 micron dots per hour and can selectively dispense into small and hard to reach places where it is difficult to screen print. See more… Asymtek Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Event Calendar White Papers Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. 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