August 20, 2008 - Technology News
Researchers Apply Self-Assembly to NIL Master for Bit-Patterned Media
A method that combines electron-beam (e-beam) patterning with a self-assembling block copolymer could prove critical to reducing the cost ...
Semiconductor International
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August 6, 2008 - Technology News
Test Socket Industry Faces Issues Scaling Below 0.4 mm Pitch
The test socket industry is encountering both electrical and mechanical issues as package pitch sizes shrink below 0.4 mm. The major ...
Semiconductor International
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August 5, 2008 - Industry News
Test Socket Industry Faces Issues Scaling Below 0.4 mm Pitch
The test socket industry is encountering both electrical and mechanical issues as package pitch sizes shrink below 0.4 mm. The major ...
Semiconductor International
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August 4, 2008 - Technology News
Alchimer Claims 'Fully Wet' Via Solution
Alchimer SA said experiments have shown that its "electrografting" technology can handle deposition of the insulation, barrier and seed ...
Semiconductor International
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August 1, 2008 - Industry News
Analyst suggests AMD may sell some ATI CE assets to Broadcom
An American Technology Research report points to AMD's ATI handset and digital TV lines and suggests Broadcom may be a possible suitor for ...
Semiconductor International
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August 1, 2008 - Industry News
ASAT Holdings Announces Financial Results for the Fourth Quarter and Fiscal Year 2008
ASAT Holdings Limited announced financial results for the fourth quarter and fiscal 2008, ended April 30, 2008. Net revenue for the 4th quarter ...
Semiconductor International
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July 24, 2008 - Technology News
Release Film Boosts IC Molding Productivity
A new molding technology that uses a heat-endurance film is on the horizon that may boost IC packaging productivity by making it easier ...
Semiconductor International
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July 23, 2008 - Technology News
Molding Techniques Support Thin Gold Wires, Low-k Materials
New low-pressure molding technologies developed by two Japan-based molding machine manufacturers support thinner IC packages created ...
Semiconductor International
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July 23, 2008 - Industry News
Funding for ISMI 450 mm Effort Doubling
The 450 mm wafer development effort is increasing funding for the Interoperability Test Bed (ITB) now underway at Sematech’s Austin, ...
Semiconductor International
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July 22, 2008 - Technology News
Molding Techniques Support Thin Gold Wires, Low-k Materials
New low-pressure molding technologies developed by two Japan-based molding machine manufacturers support thinner IC packages created ...
Semiconductor International
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July 17, 2008 - Technology News
Reducing Test Costs, Throughputs
At yesterday’s Test, Assembly & Packaging TechXPOT’s "Yield Management" session, various presenters demonstrated the necessity of reducing ...
Semiconductor International
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July 17, 2008 - Technology News
High-Density Packaging Possibilities
Cellular handsets and mobile handheld products are defining a new application space that goes beyond the realm of traditional ...
Semiconductor International
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July 17, 2008 - Industry News
Intersolar Shows PV/Semi Synergies
As photovoltaics (PV) market growth continues to skyrocket, SEMI is furthering its PV initiative at this year’s SEMICON West. In addition ...
Semiconductor International
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July 15, 2008 - Industry News
Amkor Unveils High-Performance Flip-Chip Packaging Technology
Responding to an industry shift toward thinner substrates to improve signal integrity and electrical performance, Amkor Technology Inc. ...
Semiconductor International
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July 14, 2008 - Top Story News
iNEMI Recommendations for Managing Lead-Free Solder Alloys
There are serious challenges associated with managing multiple lead-free solder alloys — in terms of both manufacturing and product ...
Semiconductor International
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July 14, 2008 - Industry News
New Packaging Technologies Dominate Best of West Awards
Underscoring the degree of innovation occurring in semiconductor packaging, four of the eight finalists in the SEMI Best of West awards ...
Semiconductor International
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July 11, 2008 - Top Story News
Gartner cuts semi equipment forecast to -22.4%
Heading grimly into the semiconductor manufacturing equipment industry’s biggest tradeshow and conference next week, Semicon West, market ...
Semiconductor International
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July 9, 2008 - Technology News
Leveraging Novel MEMS Technologies for Next-Generation Photovoltaic Applications
The MEMS industry is characterized by highly diversified, non-standardized processes for heterogeneous applications going into a ...
Semiconductor International
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July 9, 2008 - Top Story News
Applied Breaks Ground on Singapore Center
Applied Materials Inc. (Santa Clara, Calif.) broke ground on construction of the company’s Singapore operations facility, which is ...
Semiconductor International
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July 8, 2008 - Industry News
Carsem's Copper Wirebonding Program in Full Production
Carsem announced that they have been shipping production volumes of a variety of packages using copper wire bonds. Carsem has qualified a ...
Semiconductor International
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July 7, 2008 - Industry News
Flip-Chip Changes on the Horizon
Flip-chips haven't changed much since being invented by IBM in the early '60s. It's simply a method of interfacing with an an electronic ...
Semiconductor International
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July 3, 2008 - Top Story News
Flip-Chip Changes on the Horizon
Flip-chips haven't changed much since being invented by IBM in the early '60s. It's simply a method of interfacing with an an electronic ...
Semiconductor International
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July 2, 2008 - Technology News
Thin-Film Photovoltaics Capture More of the Spectrum
Silicon-based photovoltaic (PV) cells have been used for decades in calculators, and have come into wide use for garden lighting, but the ...
Semiconductor International
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July 2, 2008 - Industry News
NAND Market Faces Oversupply, Weak Demand
The memory market continues to experience challenging times, analysts said, with NAND revenue growth roughly half that of last year’s ...
Semiconductor International
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July 1, 2008 - Industry News
SMIC Lays Foundation for Shenzhen Fab
Semiconductor Manufacturing International Corp. (SMIC, Shanghai) and Shenzhen officials laid a foundation stone in the Shenzhen Grand ...
Semiconductor International
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