October 2, 2008 - Industry News
DRAM, NAND woes seen spilling into 2009
Despite a mild recovery in 2Q08, global DRAM makers are once again building inventories and pulling the rug out from prices, and the ...
Solid State Technology
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October 2, 2008 - Technology News
A vision for a next-generation 300mm factory
To help meet next-generation factory (NGF) challenges, ISMI has been tasked by its member companies to explore ways in which improvement in ...
Solid State Technology
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October 2, 2008 - Top Story News
Redefining semiconductor industry R&D
In 1987, Morris Chang, President of Taiwan’s Industrial Technology Research Institute (ITRI) and a 25-year veteran of Texas Instruments ...
Solid State Technology
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October 2, 2008 - Technology News
MoSi-ing along to 32nm
The chrome material that has blocked the light on binary masks for a generation may finally have outlived its usefulness, according to ...
Solid State Technology
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September 25, 2008 - Technology News
Organic transistors and memories, and applications
Research and Markets has announced the addition of the "Next Chips: Organic Transistors and Memories and Applications They Will Enable" ...
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September 24, 2008 - Technology News
IQE to develop graphene-based RF for US fed program
IQE expertise applied to US government program to develop Carbon Electronics for RF Applications is pleased to announce that its Pennsylvania ...
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September 17, 2008 - Technology News
Directed density multiplication for patterned disk templates
Master templates for printing fine-pitch bit patterns on magnetic disk media can be manufactured using e-beam lithography to write lower ...
Solid State Technology
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September 17, 2008 - Technology News
HDDs: terabyte/in2 a near-term reality
Patterned media technology on hard disk drives? made possible by new lithographic processes with unprecedented levels of resolution, ...
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September 5, 2008 - Technology News
On-the-fly circular substrate centering for robotized vacuum systems
A new method for on-the-fly detection and correction of substrate-centering inaccuracies of a circular substrate is presented. ...
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September 4, 2008 - Technology News
Remote connectivity reduces costs for burgeoning solar industry
The solar industry is blazing a new trail around the globe in a very similar way to the global expansion that the semiconductor industry ...
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September 4, 2008 - Industry News
The Power and Allure of 'Other'
It is relatively easy to define the mainstream semiconductor market as simply silicon-based CMOS logic and memory. That’s the big market; ...
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July 28, 2008 - Industry News
Japan's chipmaking plants slow to rally after Iwate quake
Most of the facilities that make food, electronics and other products resumed operations Thursday after a powerful earthquake in ...
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June 27, 2008 - Technology News
Researchers tout metallization technique with magnetic materials
Researchers from the National Institute of Standards and Technology (NIST) say they have developed a process to build 3D nanoscale ...
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June 23, 2008 - Industry News
Ferrotec seeking solar cell inroads to break "chip rut"
Chip equipment firm Ferrotec is one of many companies seeking to diversify into new growth opportunities, and its move into solar ...
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June 19, 2008 - Industry News
Unisem, Flip-Chip ink WLP licensing deal
Unisem Berhad and subsidiary Unisem-Advantpack Technologies (UAT) have agreed to license FlipChip International's wafer bumping and wafer- ...
Solid State Technology
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June 18, 2008 - Technology News
Intel eyes scalable FBC technology for 15nm and beyond
Among the papers being presented by Intel at the VLSI Symposium (June 17-20 in Hawaii) is one describing fabrication of the smallest reported ...
Solid State Technology
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June 18, 2008 - Industry News
Unisem, Flip-Chip ink WLP licensing deal
Unisem Berhad and subsidiary Unisem-Advantpack Technologies (UAT) have agreed to license FlipChip International's wafer bumping and wafer- ...
Solid State Technology
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May 22, 2008 - Technology News
IDM economics at 32nm and beyond
Masaaki Kinugawa, GM of Toshiba's Oita operations, discussed the tough challenges faced by fabs developing advanced processes today. Both ...
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May 21, 2008 - Industry News
Redefining fab productivity from a waste perspective
Applied Materials is urging the semiconductor industry to rethink how it defines productivity. Taking a page out of the Toyota playbook, ...
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May 14, 2008 - Technology News
450mm by 2012: Between the lines of PR lingo
Some of the biggest chipmakers are eager for a transition to 450mm wafers, because they see very attractive cost savings. And ...
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May 8, 2008 - Industry News
SEMI: Wafer shipments flat in 1Q08
Worldwide silicon wafer area shipments were roughly the same in 1Q as they were in 4Q, reflecting the industry's overall conservative ...
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May 7, 2008 - Technology News
Chip heavyweights pin down 450mm date, tout "collaboration"
Three of the world's top chipmakers -- Intel, Samsung, and TSMC -- have agreed on a due-date of 2012 to have a 450mm-wafer-capable pilot line ...
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April 21, 2008 - Industry News
SEMI: March tool demand takes a step back
Even the quarterly-ending month couldn't muster enough strength to give the industry a positive boost, as demand continues to show softness ...
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April 8, 2008 - Industry News
Feb. chip sales "weak" but no alarm for 1Q
February semiconductor sales were about 5% below expectations but the full picture for 1Q08 seems to still be within the seasonal range of ...
Solid State Technology
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March 24, 2008 - Industry News
How Taiwan's presidential elections will impact the semiconductor industry
This weekend Taiwan will elect a new president, and based on each candidate's platform -- and what each has promised to industry ...
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