We search for industry news, so you don't need to.   Thursday, Sept 11, Baltimore, MD Asymtek presents free coating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Clean & Efficient WLP Photoresist Removal EKC162 – Tested & Proven; Faster, Too EKC's WLP Photoresist Removers: a tested and proven solution for area array packaging requirements (stencil printed, plated, pillared or C4 applied). Removes resist faster, at lower temperatures, without attacking polyimides or metals. Learn more… DuPont EKC Technology   Corporate News Index May 7, 2008  -  Click the title to read the full article. Photovoltaic Production, R&D Facilities to Open in China DuPont will soon begin construction on a research center in Hong Kong and a manufacturing facility in Shenzhen to support the rapidly ... DuPont This page has been viewed 75 times. We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from DuPont August 27, 2008 - Corporate News DuPont Air Products with Interim Ruling in Patent Infringement Case DuPont Air Products NanoMaterials L.L.C. remains confident in its legal positions following a Markman ruling as part of the patent ... DuPont Air Products NanoMaterials L.L.C. July 29, 2008 - Corporate News Spansion Adopts Dupont Performance Elastomers Kalrez® 9100 Seals For Increased Productivity DuPont Performance Elastomers (DPE) has successfully collaborated with Spansion Inc. Fab 25 in Austin, Texas, to evaluate a perfluoroelastomer ... DuPont July 18, 2008 - Corporate News DuPont EKC Technology Introduces New EKC162™ Photoresist Remover for Advanced Semiconductor Packaging EKC Technology, part of DuPont Electronic Technologies, will introduce a new photoresist remover for Through Silicon Via (TSV) and Wafer Level ... DuPont July 15, 2008 - Corporate News Dupont Performance Elastomers To Introduce Kalrez® 8900 Parts DuPont Performance Elastomers will introduce Kalrez® 8900 perfluoroelastomer parts specifically designed for semiconductor thermal ... Dupont July 10, 2008 - Corporate News DuPont Performance Elastomers To Introduce Kalrez® 8900 Parts At Semicon West DuPont Performance Elastomers will introduce Kalrez® 8900 perfluoroelastomer parts specifically designed for semiconductor ... DuPont Performance Elastomers May 7, 2008 - Corporate News Photovoltaic Production, R&D Facilities to Open in China DuPont will soon begin construction on a research center in Hong Kong and a manufacturing facility in Shenzhen to support the rapidly ... DuPont March 7, 2008 - Corporate News DuPont Announces Commercial Availability of WBR 2000 Series Films DuPont Advanced Packaging Lithography has announced the full commercialization of DuPont™ WBR 2000 Series dry film photoresist ... DuPont June 29, 2007 - Corporate News DuPont Hosts Technical Panel Discussion at SEMICON DuPont Semiconductor Fabrication and Packaging Materials has announced it will host a technical panel discussion, "Technology Partnerships ... DuPont Semiconductor Fabrication & Packaging Materials October 26, 2006 - Corporate News DuPont Electronic Technologies Signs Joint Development Agreement with Taiyo Ink DuPont Electronic Technologies today announced it has signed a joint development agreement (JDA) with Taiyo Ink Manufacturing Company ... DuPont Electronic Technologies July 26, 2006 - Corporate News DuPont Opens Semiconductor Materials Technical Center in Taiwan As part of its strategic plan for long term growth in the semiconductor materials market, DuPont Electronic Technologies has established ... DuPont Electronic Technologies To find more corporate news releases from DuPont, use the search form below. Hesse & Knipps BONDJET BJ920 heavy wire bonder integrates pull and shear test Hesse & Knipps BONDJET BJ920 heavy wire bonder gives you speed, accuracy and the largest bonding area - it is also the only bonder with integrated pull and shear test. Learn more… Hesse & Knipps Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.