Steve DeDollibus, Managing Editor, Semiconductor Packaging News

I am always impressed when innovative companies collaborate with end users to share their knowledge and understanding with all of us. That will happen beginning next week when three leading equipment suppliers for the 3D Interconnect market will come together to present day-long workshops in Durham NC, May 12, Dallas TX, May 14 and San Jose CA, on May 15^th.

Hosted by SUSS MicroTec, Surface Technology Systems and NEXX Systems, the program is called “3D Integration and Packaging Technology Roadshow.” Stephen Kay, President of Sales and Service for SUSS MicroTec told us yesterday, “This event will provide insight into new technical developments in the field of 3D Integration including issues relating to Through-Silicon-Via (TSV) etching and filling, high aspect-ratio Lithography, thin wafer handling and materials associated with these processes.

Speakers from leading-edge corporations and institutes will provide a user’s point of view on critical topics for this revolutionary technology.” The day’s schedule is loaded with speakers from some of the world’s leading packaging companies and runs from 10:00am until 5:00pm. Mr. Kay went on to say that speakers would be coming from Micron, Amkor, Tezzaron, Ziptronix, RTI, Enthone, Dupont, Rohm and Haas, AZ and Microchem, all leaders in packaging and chemical processes.