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  Thursday, Sept 11, Baltimore, MD
Asymtek presents free
imagecoating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more…
Asymtek
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New Photovoltaic Coating System
Precision coating of solar wafers
imageTo apply a thin, uniform layer of phosphoric acid or phosphoric oxide based dopants and other proprietary coatings for the production of solar cells, USI has Technology for every application. Learn more…
Ultrasonic Systems, Inc.




3rd Annual MEPTEC
Medical Electronics Symposium
imageJoin MEPTEC for this symposium September 25 at Arizona State University. Topics will focus on advanced technologies in medical electronic products, and explore revolutionary concepts and enabling technologies driving future product trends. Learn more…
MEPTEC
  Industry and Technology News Index
May 7, 2008  -  Click the title to read the full article.

Chip heavyweights pin down 450mm date, tout "collaboration"
Three of the world's top chipmakers -- Intel, Samsung, and TSMC -- have agreed on a due-date of 2012 to have a 450mm-wafer-capable pilot line ...
Solid State Technology
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July 28, 2008 - Industry News
Japan's chipmaking plants slow to rally after Iwate quake
Most of the facilities that make food, electronics and other products resumed operations Thursday after a powerful earthquake in ...
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June 27, 2008 - Technology News
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June 23, 2008 - Industry News
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June 19, 2008 - Industry News
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June 18, 2008 - Technology News
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June 18, 2008 - Industry News
Unisem, Flip-Chip ink WLP licensing deal
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May 22, 2008 - Technology News
IDM economics at 32nm and beyond
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May 21, 2008 - Industry News
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May 14, 2008 - Technology News
450mm by 2012: Between the lines of PR lingo
Some of the biggest chipmakers are eager for a transition to 450mm wafers, because they see very attractive cost savings. And ...
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May 8, 2008 - Industry News
SEMI: Wafer shipments flat in 1Q08
Worldwide silicon wafer area shipments were roughly the same in 1Q as they were in 4Q, reflecting the industry's overall conservative ...
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May 7, 2008 - Technology News
Chip heavyweights pin down 450mm date, tout "collaboration"
Three of the world's top chipmakers -- Intel, Samsung, and TSMC -- have agreed on a due-date of 2012 to have a 450mm-wafer-capable pilot line ...
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April 21, 2008 - Industry News
SEMI: March tool demand takes a step back
Even the quarterly-ending month couldn't muster enough strength to give the industry a positive boost, as demand continues to show softness ...
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April 8, 2008 - Industry News
Feb. chip sales "weak" but no alarm for 1Q
February semiconductor sales were about 5% below expectations but the full picture for 1Q08 seems to still be within the seasonal range of ...
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March 24, 2008 - Industry News
How Taiwan's presidential elections will impact the semiconductor industry
This weekend Taiwan will elect a new president, and based on each candidate's platform -- and what each has promised to industry ...
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March 19, 2008 - Industry News
Analyst: Silicon MEMS microphones demand stalls
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March 19, 2008 - Industry News
Analyst: Top IC suppliers remain largely unchanged 2007
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March 13, 2008 - Top Story News
Analyst downgrades semi wafer outlook; still "balancing" solar industry, biz growth
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March 5, 2008 - Industry News
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March 4, 2008 - Top Story News
SIA: No surprise, Jan. chip sales down
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March 4, 2008 - Industry News
Fabless group, India chip body to co-support initiatives
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February 21, 2008 - Industry News
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February 12, 2008 - Industry News
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February 8, 2008 - Technology News
New silica contamination standards for UV inspection tools
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February 4, 2008 - Industry News
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Self-Assembly for Semiconductor Industry
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To find more articles from Solid State Technology, use the search form below.


Case Study & Application Note
How flat are your substrates?
image Packaging coplanarity issues begin with the flatness of your substrates. Learn more...
Cyber Technologies




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