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May 6, 2008


Register today for
International Wafer Level Packaging Conference
4 days, 3 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here!
SMTA

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Die attach and flip chip placement
imageThe Juki CX Series
The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why...
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Letters Submit

Improved Accuracy & Repeatability
for the Dispensing Process
imageGPD Global's backlit calibration station improves accuracy and repeatability in dispensing. Alignment of the dispense tip is enhanced by illuminating material dispensed during calibration from below, eliminating sheen from fluid droplets that cause errors in traditional vision alignment. Learn more …
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Top Story  
Semiconductor inventory situation worse than thought: Gartner
The electronics supply chain's semiconductor-inventory situation is worse off than earlier warnings indicated, Gartner Inc reported this morning ...
EDN

Does your reflow offer guarantees?
Ours Does
image• Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more…
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Industry News  
Semiconductor industry expected to see positive growth this year
The semiconductor industry in Southeast Asia is expected to see as much as an eleven per cent drop in equipment spending in the coming year ...
Channel News Asia
Hynix Raised DRAM Prices 15 Percent in April
Hynix Semiconductor Inc said it raised contract prices for computer memory chips by about 15 percent last month and expected further ...
eWeek
Should we be worried?
That's all we hear these days. Consumer confidence is waning, and rising oil prices are putting pressure on the economy and consumer spending. ...
Electronics Supply & Manufacturing
Semicon machinery spending set to fall
Spending on new machinery by semiconductor companies in South-east Asia (SEA) is expected to decline by around 11 per cent this year due to ...
Semiconductor International
Rapid memory price erosion slows semiconductor sales growth
Semiconductor sales growth has been substantially retarded by the energetic price erosion in memory chips, slowing growth to 3.8 percent ...
Blocks & Files
Qimonda to enter photovoltaics business
Ailing DRAM manufacturer Qimonda AG (Munich, Germany) is entering the solar cell business. In a joint venture with solar system integrator ...
EETimes
Femtocells off to slow start this year
The major electronics and communications companies working to bring femtocells to market won't have great luck cracking the market this ...
EETimes
Qimonda signs solar wafer deal
China's LDK Solar Co. Ltd. has signed a five-year contract to supply multicrystalline solar wafers to Germany's Qimonda AG. As reported, ...
EETimes
Powerchip's sales fell 18% last month
Powerchip Semiconductor Corp reported a nearly 18 percent decline in sales for last month. Net sales declined 17.69 percent to NT$5.11 ...
Taipei Times
Intel assembly plant changes face of Vietnam
Subscribers must LOG-IN to read this full story. Once you are logged in, all stories appear in their entirety. If you are a print subscriber, ...
Arkansas Online
Varian Semiconductor Ships Record-Setting 500th VIISta Single Wafer High Current System To tsmc
Varian Semiconductor Equipment Associates, Inc. recently announced that it has shipped its 500th VIISta single wafer high current implant ...
Semiconductor Online

Improve Your Uptime
High Precision Dispense Tips
imageThe DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology Advertisement
Technology News  
MEMS developer Dolomite's developing microfluidics technology to enable nanoparticle synthesis
Dolomite, a MEMS/microfluidics specialist based in the U.K., says it has been working with Newcastle University to explore using microfluidics ...
Small Times
Increasing Use Of Semiconductor Devices In End-User Segments Driving The Asian EDA Tools Market
The increased use of semiconductor devices in end-user segments drives the revenue growth of the Asian electronic design automation (EDA) ...
Semiconductor Online
Computing Reaches for Terahertz Speeds
Research at the University of Utah (Salt Lake City) has taken a step that may lead to the creation of supercomputers that run on far-infrared ...
Semiconductor International
MEMS vibration sensor debuts
The world's first micro-electro-mechanical system (MEMS) accelerometer technology capable of tracking vibrations in industrial equipment at ...
EETimes
New Analog Devices MEMS-Based Vibration Sensor Helps Keep Factory Equipment On-Line
Analog Devices, Inc. introduced a high-bandwidth MEMS vibration sensor to enable better monitoring of equipment performance and reduce costly ...
Small Times

An AOI that finds all defects
Improve quality and yield of production
imageTechnology for inspecting includes: Thickfilm, Thinfilm, LTCC, Adhesive, Overglaze, Solar Cells, Gold (Printed, plated), All printed or electroplated Layers. Learn more by clicking …
EPP Advertisement

Corporate News Submit
Ken Joyce Named President of Amkor Technology
Amkor Technology, Inc. announced that Ken Joyce has been appointed President of the company. Joyce, 61, will also continue as Chief ...
Amkor Technology, Inc.
Hesse & Knipps Wedge Bonder Improves Cost-of-Ownership for Both Ribbon and Wire Bonding
Hesse & Knipps will be demonstrating the capabilities of the BONDJET BJ820 at the upcoming International Microwave Symposium in booth 1149 ...
Hesse & Knipps
Today's Sponsor

Counterfeit Components
New white paper provides solutions
imageSuccess begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper…
Dage Precision IndustriesAdvertisement

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Desire for Two in One?
Datacon Multi-Chip Die Bonder2200 evo!
imageDispenser, die attach unit and flip chip unit in one module! An accuracy of10µm@3s at highest through-put of up to 7,000 UPH! 2200 evo: ultimate flexibility and best cost of ownership. Learn more…
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Asymtek's SV-100 Slider Valve
Faster Solder Paste Dispensing
imageUp to 20% faster than standard auger dispensers, the SV-100 achieves 20,000, 300 micron dots per hour and can selectively dispense into small and hard to reach places where it is difficult to screen print. See more…
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