October 10, 2008 - Industry News
In-House Manufacturing Remains a Core Competency at Advantest
While most of the automated test equipment (ATE) market has shifted to outsourced manufacturing, Advantest steadfastly relies on its own in ...
Semiconductor International
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October 2, 2008 - Industry News
DuPont Adds to Its WLP Offerings
Responding to the relatively healthy wafer-level packaging (WLP) market and its requirement for more advanced materials, DuPont Electronic ...
Semiconductor International
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October 2, 2008 - Industry News
Georgia Tech, Partners Launch 3-D Consortium
Georgia Institute of Technology’s (Atlanta) Packaging Research Center (PRC), along with academia partners at Fraunhofer IZM (Berlin) and ...
Semiconductor International
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October 1, 2008 - Technology News
Georgia Tech, Partners Launch 3-D Consortium
Georgia Institute of Technology's Packaging Research Center, along with academia partners at Fraunhofer IZM and Korea’s Advanced Institute of ...
Semiconductor International
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September 26, 2008 - Technology News
APSTL Claims Crystalline Silicon Advance
Advanced Packaging & Systems Technology Laboratories LLC said it is developing a thin crystalline silicon on substrate (TCSS) technology ...
Semiconductor International
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September 24, 2008 - Industry News
Ambitious Plan for N.Y. Packaging Center
Plans for an advanced packaging R&D center in New York state call for a public-private partnership, with packaging infrastructure companies ...
Semiconductor International
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September 19, 2008 - Industry News
STATS ChipPAC Introduces Pre-Stacked PoP Solution
STATS ChipPAC introduced a new Pre-Stacked Package-on-Package solution that includes both a top and bottom PoP package that are assembled and ...
Semiconductor International
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September 17, 2008 - Industry News
Samsung Electronics Tops Global Multi-Chip Package Market
Samsung Electronics Co. maintained its position as the world's dominant seller of multi-chip packages (MCP) in 2007, a market report showed ...
Semiconductor International
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September 16, 2008 - Technology News
Spin Transistors and OLEDs Draw Closer
University of Utah physicists John Lupton and Christoph Boehme have successfully used electron spin to control an electrical current, an ...
Semiconductor International
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September 11, 2008 - Technology News
Seiko Epson Says Resin Bumping Reliable
Seiko Epson Corp. (Tokyo) has disclosed technical details and reliability results concerning its proprietary resin-based gold bumping ...
Semiconductor International
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September 9, 2008 - Top Story News
Brazilian 'Photonic Beetle' Points Way to Ultrafast Computing
Scientists have discovered that their research to build photonic crystals was redundant -- Mother Nature had already produced them with the ...
Semiconductor International
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September 5, 2008 - Industry News
Tegal Acquires Alcatel Micro Machining Systems in DRIE Move Aimed at TSVs
With 3-D wafer-level interconnects as a major target, Tegal Corp. said it will acquire the deep reactive ion etch (DRIE) and plasma enhanced ...
Semiconductor International
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September 4, 2008 - Technology News
Encapsulant Lowers Solar Cost Through Materials and Process
In its efforts to become the material house for the photovoltaics industry -- from ingot to module and perhaps installations as well ...
Semiconductor International
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September 4, 2008 - Technology News
Tegal Acquires Alcatel Micro Machining Systems in DRIE Move Aimed at TSVs
With 3-D wafer-level interconnects as a major target, Tegal Corp. said it will acquire the deep reactive ion etch and plasma enhanced chemical ...
Semiconductor International
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September 3, 2008 - Industry News
July Chip Sales up 7.6% Year-on-Year
Worldwide sales of semiconductors grew by 7.6 percent to $22.2 billion in July from July 2007 sales of $20.6 billion. Sales grew by 2.8 percent ...
Semiconductor International Association
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September 2, 2008 - Industry News
Solar Conference Chair Makes Call for Scientists
At the opening session of the European Photovoltaic Solar Energy Conference (EU PVSEC) this morning in Valencia, Spain, Daniel Lincot, ...
Semiconductor International
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September 2, 2008 - Top Story News
Semiconductor industry heading into 'era of profitless prosperity'
The semiconductor industry may be heading into an "era of profitless prosperity," according to Stephen Newberry, president and CEO of Lam ...
Semiconductor International
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September 2, 2008 - Technology News
Fine-Tuning CMP
With each new technology node, all process windows become progressively smaller, and the window for overpolishing is no exception. Shrinking ...
Semiconductor International
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September 2, 2008 - Technology News
Dow Corning aims to decrease cost of solar power with manufacturing process
Aimed at significantly increases the production rate of solar panels to lower the cost per watt of solar power, Midland, Mich-based Dow ...
Semiconductor International
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August 29, 2008 - Industry News
STATS ChipPAC to Manufacture Infineon’s First-Gen eWLB Products
In early August, STMicroelectronics, Infineon Technologies AG and STATS ChipPAC unveiled an alliance to jointly develop the next-generation of ...
Semiconductor International
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August 28, 2008 - Industry News
Sitronics Plans 300 mm Fab at Zelenograd
Sitronics Inc. (Moscow) will receive more than a billion dollars from a Russian governmental investment fund to build a 300 mm wafer fab at ...
Semiconductor International
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August 27, 2008 - Technology News
Magma to Develop Yield Enhancement Software for Solar Cell Fabs
Magma(r) Design Automation Inc. announced development of a new yield enhancement software system customized for solar fabs to improve ...
Semiconductor International
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August 26, 2008 - Top Story News
SEMI's Forum Considers Slow Growth, Memory Pains, Design Capability Decline
At SEMI’s Silicon Valley Lunch Forum, held in Santa Clara, Calif., three leading analysts shared their views on the state of the industry over ...
Semiconductor International
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August 20, 2008 - Technology News
Researchers Apply Self-Assembly to NIL Master for Bit-Patterned Media
A method that combines electron-beam (e-beam) patterning with a self-assembling block copolymer could prove critical to reducing the cost ...
Semiconductor International
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August 6, 2008 - Technology News
Test Socket Industry Faces Issues Scaling Below 0.4 mm Pitch
The test socket industry is encountering both electrical and mechanical issues as package pitch sizes shrink below 0.4 mm. The major ...
Semiconductor International
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