We search for industry news, so you don't need to.   Thursday, Sept 11, Baltimore, MD Asymtek presents free coating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers High-Speed Stamp Soldering New white paper This paper examines stamp soldering, a solution that provides consistent amounts of molten solder onto a printed circuit board using static volumetric solder stamps during the through-hole soldering process. Click to learn more … Juki Corporation Tested & Proven WLP Resist Removal by EKC Fast, Low Temp, Won't Attack Metals Formulated to enhance the removal of resists cleanly and efficiently, with full dissolution, preventing redeposition, while minimizing damage to metal conductors, bumps and RDL dielectrics. Specially formulated for WLP applications. Learn more… DuPont EKC Technology   Corporate News Index May 6, 2008  -  Click the title to read the full article. Ken Joyce Named President of Amkor Technology Amkor Technology, Inc. announced that Ken Joyce has been appointed President of the company. Joyce, 61, will also continue as Chief ... Amkor Technology, Inc. This page has been viewed 65 times. We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Amkor Technology, Inc. July 8, 2008 - Corporate News Amkor Announces New Flip Chip Packaging Technology at SEMICON West Amkor Technology, Inc.announced the introduction of a new flip chip packaging technology to be featured at SEMICON West2008 July 15 - 17... Amkor Technology, Inc. May 15, 2008 - Corporate News Amkor to Present at JP Morgan Technology Conference Amkor Technology, Inc. announced that Joanne Solomon and Jim Fusaro will participate in the JP Morgan 36th Annual Technology Conference in ... Amkor Technology, Inc. May 6, 2008 - Corporate News Ken Joyce Named President of Amkor Technology Amkor Technology, Inc. announced that Ken Joyce has been appointed President of the company. Joyce, 61, will also continue as Chief ... Amkor Technology, Inc. March 4, 2008 - Corporate News Amkor Technology Introduces FusionQuad(TM) Amkor Technology, Inc. announced the introduction of FusionQuad™, a novel package technology designed for applications that demand ... Amkor Technology, Inc. July 18, 2007 - Corporate News AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer-Level Packaging Amkor Technology, Inc. and IMEC announced that they have entered into a 2-year collaboration agreement to develop cost-effective, 3D ... Amkor Technology, Inc. To find more corporate news releases from Amkor Technology, Inc., use the search form below. Bringing the Best Together Ablestik & Emerson Cuming's join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson Cuming will deliver results for your production requirements. Learn more … Henkel Corporation Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.