We search for industry news, so you don't need to.
 
Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers
May 5, 2008


Register today for
International Wafer Level Packaging Conference
4 days, 3 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here!
SMTA

Advertisement
Die attach and flip chip placement
imageThe Juki CX Series
The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why...
Juki Corporation Advertisement
Letters Submit

Improved Accuracy & Repeatability
for the Dispensing Process
imageGPD Global's backlit calibration station improves accuracy and repeatability in dispensing. Alignment of the dispense tip is enhanced by illuminating material dispensed during calibration from below, eliminating sheen from fluid droplets that cause errors in traditional vision alignment. Learn more …
GPD Global Advertisement
Top Story  
Chip-Equipment Sales to Fall 15% in 2008
Global spending on chip equipment may fall 15% this year, extending an industry contraction, according to the San Jose, California-based ...
Bloomberg

Vapor Phase Soldering
White paper Download
imageWafer bumping and package attach becomes more complex with lead free alloys. Vapor Phase provides an Oxygen free, 0 deg delta T alternative to conventional thermal systems. Download this white paper to learn more.
A-Tek LLC Advertisement
Industry News  
Electronics' 'missing link' found
Details of an entirely new kind of electronic device, which could make chips smaller and far more efficient, have been outlined by scientists ...
BBC News
DRAM rankings: Samsung seeks to bury competitors
Samsung Electronics Co. Ltd. clung to its DRAM market lead in the first quarter, according to market researcher iSuppli Corp., cranking up ...
EETimes
Icahn's Motorola Morass
What if you held a party and nobody came? What if you held a sale and nobody bid? That is exactly the situation at Motorola. About a year ...
Forbes
Domestic enterprises eyeing huge market potential for LED lamps
In early 2008, the Ministry of Finance and the National Development and Reform Commission co-issued the Interim measures on the management of ...
China Economic Net
Probe of chip cartel set to broaden
Ken Heller knew his company might have crossed the line. The sales executive for Hynix Semiconductor Inc. and his co-workers had been ...
Palm Beach Post
IC Packaging and testing industry to move into stagnation in 2008
The IC packaging and testing industry is expected to enter a year of 'stagnation' in 2008 before staging an upturn in 2009, Bough Lin, ...
DigiTimes
SAFC Hitech opens $9 million facility
SAFC Hitech has opened a new $9 million cleanroom facility at the company's Sheboygan Falls, Wisconsin campus. The 5,000-square-foot ...
EETimes

Die Bonding Made Easy
Precision X-Form Needles
imageThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology Advertisement
Technology News  
OptiSolar sets sights on world's largest solar farm
OptiSolar aims to build the largest solar farm in the world some 100 miles north of Los Angeles. It would amount to 550 megawatts and ...
CNet News
Contact through silver particles in ink
Conductor paths in sensor systems have to be correctly ‘wired’. Now, instead of using obtrusive connecting wires, researchers print the ...
Nanowerk LLC
Raytheon Exoskeleton brings 'Iron Man' to life
The much-ballyhooed movie, "Iron Man," opens in theaters worldwide, but the real "iron man" is already under construction at Raytheon in Salt ...
EETimes
Memristor, the Holy Grail of circuit theory
And now comes the memristor. HP Labs researcher R. Stanley Williams said he has invented what is considered the fourth and final piece of electronic ...
EETimes
Researchers see a tiny new world
If you drive a car, cook, wear contact lenses or have a stent in a blood vessel, you may have been touched by the work of Agilent Technologies. ...
Clarksville Leaf Chronicle
IP violations to cost suppliers US$4.5 bil
IP rights violations have caused significant losses to nearly half the suppliers of semiconductor equipment and materials, according to a ...
China Post

An AOI that finds all defects
Improve quality and yield of production
imageTechnology for inspecting includes: Thickfilm, Thinfilm, LTCC, Adhesive, Overglaze, Solar Cells, Gold (Printed, plated), All printed or electroplated Layers. Learn more by clicking …
EPP Advertisement

Corporate News Submit
No One Won DRAM “Chicken” Game in the First Quarter
In the dangerous game of "chicken," two drivers aim their cars at each other and accelerate to full speed. The first driver to swerve is the ...
iSuppli Corporation
JPSA Laser to Intro High Performance Wafer Processing Systems at SEMICON
J P Sercel Associates will unveil its IX-4000 series of high-throughput, high speed Class 1 laser workstations at SEMICON West 2008. There are ...
JPSA Laser
Kyzen to Highlight MICRONOX MX2302 at Semicon Singapore 2008
Kyzen Corporation announces that it will feature its award-winning advanced technology MICRONOX MX2302 wafer-level cleaning solution in ...
Kyzen Corporation
Web Seminar Advanced Validation and Testing of PCIe 2.0
PCI Express brought about a whole new series of challenges for designers and the next generation. PCI Express 2.0 takes the challenges to a ...
Agilent Technologies
Today's Sponsor

Counterfeit Components
New white paper provides solutions
imageSuccess begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper…
Dage Precision IndustriesAdvertisement

Advertisement
Desire for Two in One?
Datacon Multi-Chip Die Bonder2200 evo!
imageDispenser, die attach unit and flip chip unit in one module! An accuracy of10µm@3s at highest through-put of up to 7,000 UPH! 2200 evo: ultimate flexibility and best cost of ownership. Learn more…
Datacon Technology GmbH Advertisement

Advertisement
Asymtek's SV-100 Slider Valve
Faster Solder Paste Dispensing
imageUp to 20% faster than standard auger dispensers, the SV-100 achieves 20,000, 300 micron dots per hour and can selectively dispense into small and hard to reach places where it is difficult to screen print. See more…
Asymtek Advertisement


Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News
Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers
Search Category       Search Term   
To search a phrase, place it in quotes.
Semiconductor Packaging News - A Circuitnet Publication
We search for industry news so you don't need to.

Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA
Copyright © 2008 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager


Visit Circuitnet for the latest electronics assembly news and information.