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  Solar wafer coating - White paper
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Ultrasonic Systems, Inc.
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YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
M1mYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech




Vapor Phase Soldering
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Vapor Phase SolderingWafer bumping and package attach becomes more complex with lead free alloys. Vapor Phase provides an Oxygen free, 0 deg delta T alternative to conventional thermal systems. Download this white paper to learn more.
A-Tek LLC
  Corporate News Index
May 5, 2008

JPSA Laser to Intro High Performance Wafer Processing Systems at SEMICON

Manchester, New Hampshire, USA – J P Sercel Associates (JPSA) will unveil its IX-4000 series of high-throughput, high speed Class 1 laser workstations at SEMICON West 2008. There are two systems in the 4000 series; the IX-4100 ChromaDice and IX-4600 CromAblate. Both are designed for automated wafer processing with the ability to handle up to 300mm wafers. The IX-4100 ChromaDice is designed for wafer singulation applications, whilst the IX-4600 ChromAblate is ideal for LED production, selective wafer annealing, micro-drilling, thin film patterning, 3-D micromachining, and many more applications. The IX-4100 system will be on exhibit in booth #8713.

Based on the successful IX-210 and IX-260, the 4100 and 4600 feature automation and capability enhancements. In addition to 300mm wafer processing, these enhancements include automatic wafer loading, an integrated automated coating/cleaning station, and a vision system for automatic wafer alignment. JPSA IX- 4100 series systems employ UV laser energy in a fast, low-stress method of singulation that minimizes chip breakage after cutting, for higher yields, with kerfs as narrow as 2.5 microns, and minimal debris generation in a vibration-free process. The IX-4600 is a UV excimer-based laser system that uses proprietary and patented UV laser technology to produce high-brightness LEDs through a patented lift-off method. LED liftoff dramatically reduces the time and cost of the LED fabrication process. Additionally, it enables the manufacturer to grow vertical design LED devices which provide the highest light output LEDs.

JPSA IX-4000 series systems are designed and optimized for demanding 24/7 high volume production, yet boast high accuracy. The IX-4600 ChromAblate can micromachine features to 2um or be configured for large area exposure of up to 5mm x 5mm. These systems feature dual cassette load ports, production grade robotics, and many other robust features characterizing industrial-grade systems. They are compact, modular, fully automated, versatile systems with large work areas and full accessibility.

Contact:
JPSA Laser


http://www.jpsalaser.com

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May 5, 2008 - Corporate News
JPSA Laser to Intro High Performance Wafer Processing Systems at SEMICON
J P Sercel Associates will unveil its IX-4000 series of high-throughput, high speed Class 1 laser workstations at SEMICON West 2008. There are ...
JPSA Laser
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