We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers May 2, 2008 Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Letters Submit Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Top Story   Semi equipment industry stands to lose up to $4B annually due to IP infringement Semiconductor equipment and materials suppliers are facing serious and mounting challenges in regard to intellectual property (IP) protection ... EDN Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Industry News   First-Quarter Semiconductor Sales Show 3.8% Year-on-Year Gain Worldwide sales of semiconductors of $63.4 billion for the first quarter of 2008 were 3.8 percent higher than the $61.1 billion reported for ... SIA Amkor Technology shares soar on strong 2Q outlook Microchip assembly and test company Amkor Technology Inc. soared nearly 30 percent Thursday after it said it expects its second-quarter ... AP Tessera Q1 profit lags Street, ups Q2 revenue outlook Chip technology developer Tessera Technologies Inc posted a first-quarter profit that was slightly below market expectations, but ... Reuters ASE Q1 net up 41 pct, sees higher Q2 sales Top microchip packaging firm ASE posted a 41 percent rise in first-quarter profit thanks to growing chip demand for computers and ... Reuters STMicro shares rise on bright outlook, despite 1Q loss European chip maker STMicroelectronics NV, hit by costs from a spinoff and an acquisition, reported a loss for the first quarter and fell ... AP Sun Micro revenue falls, cuts 2,500 jobs Sun Microsystems Inc. on Thursday (May 1) posted an unexpected net loss and decline in quarterly revenue, saying the U.S. economy ... EETimes Memory weakness masking healthy semi sales growth, SIA says With weakness in memory revenue from price erosion masking the overall strength of semiconductor sales, the Semiconductor Industry ... EDN Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation Technology News   Electronics' 'missing link' found Details of an entirely new kind of electronic device, which could make chips smaller and far more efficient, have been outlined by scientists ... BBC News Technology and Applications of LEDs There is a growing movement in the global community to replace the incandescent light bulb with alternative lighting sources such as ... LEDs Magazine Package-on-Package Variations On the Horizon When Apple’s iPhone debuted in 2007 and teardowns were immediately featured and available seemingly overnight, package-on-package (PoP) ... Semiconductor International 3-D Interconnections On the Rise The chip has been unchallenged as the ultimate form of electronic circuit integration since the invention of the IC. The rate of increased ... Semiconductor International Innovative Film Protects Thin-Film Solar Cells, Other Plastic Electronics Scientists from Singapore’s Institute of Materials Research and Engineering (IMRE) have developed a barrier film that enables a ... Semiconductor International Solid-state cooling device harnesses corona discharge Thorrn Micro Technologies has demonstrated a small, silent, no-moving-parts cooling device that generates more airflow than mechanical fans ... EDN Motor driver ICs suit fast stop/start The A1444 and A1445 employ a soft-switching algorithm to reduce audible switching noise and EMI interference.Allegro MicroSystems Europe has ... Electronics Talk Livermore: a chip off Silicon Valley's block? A growing number of technology and telecommunications companies are finding their way to Livermore. The latest case in point is Long ... Oakland Tribune Circuit and software provide accurate recalibration for baseline PIC microcontroller’s internal oscillator All of Microchip’s baseline PIC microcontrollers have internal 4-MHz oscillators, which are useful for freeing up one or two pins for I/O ... EDN Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Corporate News Submit MEMS Business and Management, a "short course" for entrepreneurs, intrapreneurs & investors From entrepreneurs looking to bring commercial MEMS technology to market, intrapreneurs considering the launch of a MEMS business unit ... MEMS Today's Sponsor ShinEtsu Resists - Perfect for 3D packaging, WLP, TSV and wafer bonding For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion. ShinEtsu Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Control Costs and Maximize Yield Discover the XD7600NT If you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. Learn more… Dage Precision Industries Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.