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April 24, 2008


Online Auction - Final Day
Electronics Packaging Machinery
Online AuctionJoin us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more…
Go Industry DoveBid

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Semiconductor Packaging News
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Semiconductor Packaging News
Letters Submit

Asymtek's new DispenseJet® DJ-100
combines high speed accuracy & process control
Dispensejet DJ-100 The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more…
Asymtek
Top Story  
3D Packaging Technologies Evolve
Three-dimensional (3D) packaging is expected to emerge as a dominant performing solution in the electronic/chip packaging industry. Its ...
Yahoo! Finance

Improve Your Uptime
High Precision Dispense Tips
Precision needlesThe DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology
Industry News  
TSMC CEO upbeat about IC growth
At its 2008 Technology Symposium here, a top executive at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) forecasted a relatively ...
EETimes
Tradition gives way to necessity at TI
As its wireless business weakens due to downward pressures from the high-end consumer market and strategic sourcing changes at a major OEM ...
Electronics Supply & Manufacturing
Spansion creates Flash memory security division in Italy
NOR Flash supplier Spansion Inc. announced it has established headquarters for its Security and Advanced Technology Division (SATD) ...
Electronics Supply & Manufacturing
Apple Buys Chip Designer
Apple has agreed to buy a boutique microprocessor design company called PA Semi. The company, which is known for its design of sophisticated ...
Forbes
IC design houses optimistic on positive demand projection of customers
Following a recent consumer electronics tradeshow in Hong Kong, Taiwan IC design houses have optimistic outlooks due to positive demand ...
DigiTimes
STATS ChipPAC Reports First Quarter 2008 Results
Tan Lay Koon, President and Chief Executive Officer of STATS ChipPAC, said, "Revenue for the first quarter of 2008 of $427.2 million ...
Earthtimes
Chip design services market seen at $7.4 b
The Indian semiconductor and embedded design services industry is expected to cross $7.37 billion in 2008, said a report published by ...
Sify
Boom seen in SIM card shipments
Shipments of SIM cards last year increased by 28 percent, with growth being driven by demand and opportunities in emerging markets and from ...
EETimes

Full Wafer Die Attach
Deposition in a Single Stroke
Full Wafer Die Attach White PaperLearn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download…
Henkel Corporation
Technology News  
Photoluminescence in nano-needles
Silicon is the workhorse among semiconductors in electronics. But in opto-electronics, where light signals are processed along with ...
PhysOrg
LED lightbulbs: Are you ready to make the switch?
High price and a strange color. No, we're not talking about a hairdo. Those are the two factors that have kept light-emitting diodes, or ...
CNet News
Semiconductor Industry Launches Anti-Counterfeiting Campaign
The Semiconductor Industry Association (SIA) today released a directory of authorized distributors to help combat the growing problem of ...
Business Wire
Startup Adapting MEMS Technology for RFID Authentication
Startup Veratag of Cohoes, New York, is adapting tiny micro electromechanical systems (MEMS) components to create chips that can ...
RFID Update
MIT gets serious about solar power
The Massachussets Institute of Technology is expanding its solar power research from a "boutique" option to an affordable, mainstream energy ...
EETimes

Red-E-Set Universal Boards Supports
ROI CALCULATOR
Red-E-setProduction Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more…
Production Solutions, Inc.

Corporate News Submit
Ultratape Announces Sample Kits Available For Purchase via web
UltraTape Industries announced the availability of sample kits for purchase through their website. There are currently 5 sample kits ...
UltraTape Industries
ITT Develops High Temperature Micro Connector Assemblies
ITT Interconnect Solutions has developed a series of high temperature micro connectors. Designated the MDM Series, the connectors are rated ...
ITT Interconnect Solutions
Today's Sponsor

ShinEtsu Resists - Perfect for 3D packaging,
WLP, TSV and wafer bonding
ShinEtsu ResistFor stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion.
ShinEtsu

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White Paper: Photo Resist coating
Precision coating with Ultraspray Technology
Photo Resist WPOutlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper…
Ultrasonic Systems, Inc.

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Control Costs and Maximize Yield
Discover the XD7600NT
Dage Precision IndustriesIf you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. Learn more…
Dage Precision Industries


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