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April 14, 2008


Red-E-Set Universal Boards Supports
ROI CALCULATOR
Red-E-setProduction Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more…
Production Solutions, Inc.

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Run Cooler
with Thermal Interface Materials from Shin Etsu
Run CoolerThermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more…
ShinEtsu
Letters Submit

mBGA Flux deposition
with ultrasonic coating technology
mBGAUSI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more...
Ultrasonic Systems, Inc.
Top Story  
iSuppli Cuts 2008 NAND Growth Forecast by Two-thirds
Amid signs that major buyers are slashing their expected order growth for NAND-type flash in 2008, iSuppli Corp. is cutting its forecast for ...
ECN

Having Trouble Inspecting 3D Packages?
CT offers virtual micro-sectioning
Dage Precision Industries CTIn today's competitive world, quality is everything. Computerized tomography completely examines features that otherwise remain hidden. The Dage XD7600NT provides the fastest CT reconstruction in the industry and can be easily switched from 2D to 3D modes. Learn more…
Dage Precision Industries
Industry News  
IDMs follow dinosaurs out
The NXP-STMicroelectronics wireless IC joint venture announced sounded the death knell for the semiconductor industry's most enduring business ...
Electronics Supply & Manufacturing
Gordon Moore on the early days of the chip industry
Part of the challenge of making semiconductors in the 1950s was developing your own equipment. "All of the equipment for the photo ...
CNet News
Flat electronic component orders reflect industry’s 'wait and see' attitude
Electronic component orders flattened in March following ups and downs over the past five months. That’s according to the Electronic ...
EDN
Asian chip makers jump on DRAM recovery hopes
Shares of leading Asian chip makers jumped after recent price hikes convinced investors that the computer memory chip market is finally ...
EETimes
Cloudy Future for Applied Material's SunFab
Applied Materials is up 8% this year as investors eagerly anticipate an announced $3B in orders from its SunFab solar-panel line, which ...
Seeking Alpha
Widespread Use of MEMS Accelerometers in Coming Years, Says ABI Research
MEMS accelerometers have hit the limelight in the past year, although most consumers are probably quite unaware that they make the Nintendo ...
Tech-On
Simtek Board Rejects Proposal from Cypress Semiconductor as Not in Stockholders' Best Interests
Simtek Corporation confirmed that it has received a proposal from Cypress Semiconductor Corporation to acquire Simtek for $2.20 per share ...
Fox Business
A breath of fresh air — Clean-room firm thriving after bankruptcy woes
The word "bankruptcy" conjures up a lot of images about a company. It's an albatross that has left many companies relegated to the history ...
Deseret News

Online Auction - Final Day
Electronics Packaging Machinery
Online AuctionJoin us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more…
Go Industry DoveBid
Technology News  
Microcontroller suppliers crank up design support
The level of competition in the microcontroller market has never been higher. Suppliers are relying more than ever on the strength of the ...
Electronics Weekly
Avago’s CSP technology yields smallest FETs for multiple wireless applications
Avago Technologies of San Jose, CA, USA has announced what it claims is the industry’s smallest packaged field effect transistors (FETs) ...
Semiconductor Today
Nanotechnology: Getting small is getting big
When a new interactive lottery game is field-tested this summer by the Pennsylvania Lottery, the ink on the electronic scratch ticket will ...
Trading Markets
Imation Atom Flash Drive. Perhaps Subatomic to Follow?
Until USB 3.0 becomes a reality, all we can talk about a flash drive is either security or size. When Imation Atom comes along, we know it's ...
Everything USB
BJTs with ultrafast switching save on energy
Fairchild Semiconductor Corp.'s 3A and 5A bipolar junction transistors (BJTs) contribute to energy-savings in electronic ballast, power ...
EETimes Asia

Semiconductor Packaging News
Advertising delivers!
Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more…
Semiconductor Packaging News

Corporate News Submit
Amkor Technology Names Eric Larson Executive Vice President Product Management Group
Amkor Technology, Inc. announced that Eric Larson will join the company as Executive Vice President Product Management Group, effective April ...
Amkor Technology
3D Integration and Packaging Event of 2008
If you are an industry professional interested in 3D Integration and Packaging applications this event is a must. For all those wanting to ...
SUSS MicroTec Inc.
ECT Wins a 2008 NPI Award for Its Gemini Kelvin Spring Pins
Everett Charles Technologies (ECT) Semiconductor Test Group (STG) announces that its Gemini Kelvin spring probe was awarded a NPI Award ...
Everett Charles Technologies
Today's Sponsor

Asymtek's new DispenseJet® DJ-100
combines high speed accuracy & process control
Dispensejet DJ-100 The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more…
Asymtek

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Improve Your Uptime
High Precision Dispense Tips
Precision needlesThe DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology

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Full Wafer Die Attach
Deposition in a Single Stroke
Full Wafer Die Attach White PaperLearn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download…
Henkel Corporation


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