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April 9, 2008


Online Auction - Final Day
Electronics Packaging Machinery
Online AuctionJoin us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more…
Go Industry DoveBid

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Semiconductor Packaging News
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Semiconductor Packaging News
Letters Submit

Asymtek's new DispenseJet® DJ-100
combines high speed accuracy & process control
Dispensejet DJ-100 The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more…
Asymtek
Top Story  
MEMS markets could explode
Microelectromechanical system (MEMS) oscillators are replacing quartz crystals at a 120 percent annual growth rate, according to an ...
EETimes

Die Bonding Made Easy
Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
Industry News  
Q1 semi sales decline seasonal, Q2 quarter to watch, Gartner says
The fate of 2008’s semiconductor market was not sealed in Q1, according to research from Gartner Inc. Noting recently released World ...
EDN
Global semiconductor industry: India to buck the trend
A sharp drop in US consumer spending, driven by high energy prices and the subprime turmoil, has started hitting the global semiconductor ...
Economic Times
AMD Cuts Follow Intel Restructuring
Advanced Micro Devices Inc.'s plans to jettison 10 percent of its work force are the latest sign that the seesaw battle between ...
AP
Cypress develops niche CMOS image sensor market
While leading CMOS image sensor vendors OmniVision and Micron Technology have been competing keenly in the handset-use CMOS image ...
DigiTimes
IC packagers' China plans approved
Four domestic chip packagers and testers, including Siliconware Precision Industries Co Ltd, obtained the government’s approval to ...
Taipei Times
KLA-Tencor plans to buy Belgian company
The San Jose-based semiconductor testing equipment maker said the bid price is the equivalent of about $57.33 per share, $51.46 for each ...
Silicon Valley/San Jose Business Journal
Mospec outputs its first solar grade monocrystalline ingots
Mospec Semiconductor has output its first solar grade monocrystalline silicon ingots, marking a major move toward the company's development ...
DigiTimes

Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
Technology News  
Inside Shenzhen: A tale of two chip entrepreneurs in China's manufacturing hub
This bustling border town just across the frontier border north of Hong Kong is making slow but steady progress as a small but growing center ...
EETimes
Power management in mobile devices--A view of energy Conservation
The gaps grow larger between what mobile devices can do and the amount of energy engineers can deliver. Chapter 2 from Power Management in ...
Mobile Handset Design Line
Intel to Invest $500 Million in China
Intel introduced a $500 million China fund in an effort to increase investments in companies in the world's biggest semiconductor market. ...
International Business Times
Lubricant Found to Oil Micromechanical Systems
Now researchers say they have found a fix. By saturating devices with argon gas containing a small amount of alcohol vapour, they can ...
MedGadget
Sunovia and EPIR Announce Technology and Manufacturing Breakthroughs for Infrared Sensors and Next-Generation Solar Cells
Sunovia Energy Technologies, Inc. is pleased to announce technology and manufacturing breakthroughs by EPIR Technologies, Inc. EPIR's research ...
Electric Energy Online
AMCC to Demonstrate Embedded Power Architecture
Applied Micro Circuits Corporation announced that it will team with customers and partners to showcase advanced solutions of its line of ...
Chip Design Magazine

Red-E-Set Universal Boards Supports
ROI CALCULATOR
Red-E-setProduction Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more…
Production Solutions, Inc.

Corporate News Submit
SUSS MicroTec Installs First 300 mm WLR Test System in Japan
SUSS MicroTec AG announced the installation of its PM300WLR, the world’s most advanced 300 mm wafer-level reliability (WLR) test system, at a ...
SUSS MicroTec
Novellus Announces Preliminary First Quarter Results
Novellus Systems, Inc. announced preliminary financial results for its first fiscal quarter ended March 29, 2008. Revenue for the first ...
Novellus
The Compound Semiconductor Substrate Business will Break the Billion Dollar Barrier by 2009
Electronics.CA Publications announces the availability of a new report entitled "Compound Semiconductor Materials Market". For more than 20 ...
Electronics.CA Publications
Tronics Microsystems Achieves Annual Net Profit of 1.3 Mill. Euros
Tronics Microsystems SA announced that it achieved a 56 percent increase in annual revenue, to 10.5 million Euros ($15.4 million) in its fiscal ...
Tronics Microsystems SA
Today's Sponsor

Run Cooler
with Thermal Interface Materials from Shin Etsu
Run CoolerThermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more…
ShinEtsu

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Solar wafer coating - White paper
USI has developed Nozzle-less
Solar wafer coatingUltrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more…
Ultrasonic Systems, Inc.

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Checking for Brittle Fracture Failures?
Replace drop testing with high strain rate bondtesting
Dage Precision Industries BTDetecting brittle fracture failures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more…
Dage Precision Industries


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