We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers April 2, 2008 Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Letters Submit Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Top Story   Semiconductor materials grew 14% in 2007, SEMI says While the semiconductor industry grew just 3% last year to reach $256 billion, the global market for semiconductor materials market grew ... EDN Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Industry News   Inventories down amid soft IC demand Good news: Chip inventories are down. Bad news: There is still more trouble ahead for IC makers. Excess semiconductor inventory is ... EETimes Intel says we're close to a very cool future for mobile devices Personal digital assistants, cell phones, smartphones--whatever you want to call them--keep getting smaller, thinner, and lighter. Congrats to ... CNet News Gone In A Flash Intel is starting to run out of businesses it can get rid of. The company finally ditched its money-losing NOR flash memory business ... Forbes DRAM makers consider pushing prices up DRAM makers Elpida Memory and Samsung plan to raise prices for DRAM memory chips as much as 20% this month, despite reports from some ... Purchasing China Shows Highest Growth Rate of Semiconductor Materials Market in 2007 The global semiconductor materials market grew 14% year-on-year to US$42 billion in 2007, according to the report of SEMI (Semiconductor ... Tech On $650M investment in chip fab would create 5,514 jobs A new study says a $650 million investment by New York to land a computer chip manufacturing company would result in the creation of ... The Business Review Scientists develop new nano-scale chip circuitry technology Korean scientists said that they have developed a technology to greatly reduce the thickness of semiconductor circuitry and allow the ... Korea.net News US First Solar starts building new plants US-based First Solar Inc, a manufacturer of solar panels, has started construction work on the second and third solar panel plants as part ... The Star Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Technology News   Stronger and Lighter — Composites Make Their Mark Most engineers likely know the new Boeing 787 Dreamliner is made primarily of carbon-fiber-reinforced epoxy composites. Considering ... Machine Design Freescale Provides MRAM Technology for Siemens' Touchscreen Products Freescale Semiconductor, a provider of magnetoresistive random access memory (MRAM) products, announced that is providing non-volatile ... IT News Online Intel trots out wireless chips, discusses eight cores at IDF Intel has started shipping its long awaited low-power chip for wireless devices, but the company is clearly starting at the high end of the ... CNet News WLP Could Transform MOEMS, MEMS Packaging costs of microelectromechanical systems (MEMS) still account for more than 50% of the total cost of most of these devices. ... Semiconductor International IEDM: 32nm-Gen Logic ICs, Stacked-Cell Flash The cost for logic IC chips in the 32nm generation will drop below that of the 45nm generation. Performance will rise, and dissipation drop. ... Tech On Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Corporate News Submit DEKsolar.com goes live! DEK has launched a brand new website dedicated purely to solar cell manufacture. Reinforcing the mass imaging leader’s proven authority ... DEK Frost & Sullivan Reviews MEMS Test Equipment Market According to Frost & Sullivan, if the micro-electro-mechanical systems (MEMS) test equipment market is to match the pace of the overall MEMS ... Frost & Sullivan Today's Sponsor ShinEtsu Resists - Perfect for 3D packaging, WLP, TSV and wafer bonding For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. 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Learn more… Dage Precision Industries Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.