Phil Vere, Managing Director – Bond Testing, Dage Precision Industries

Semiconductor packaging continues to gravitate toward 3D packaging such as package-in-package (PiP), package-on-package (PoP) and system-in-package (SiP) driven in large part by the growing functionality of handheld products. These 3D packages typically contain more bumped devices as semiconductor suppliers’ move away from wire bonding due to density, size reduction and the need for increased speed.

At the same time, the increased use of lead-free solder in portable products makes them susceptible to brittle fracture failures at the solder ball to pad interface when subjected to mechanical shock. High-speed bondtesting including high-speed solder ball shear and pull testing has proven to be a reliable indicator of drop test performance without the expensive and ambiguous results.

A major initiative in 2008 is that we will continue to push the boundaries on high-speed shear and high-speed pull bond testing and develop this growing market as well as the test methodology. This includes the ability to handle ever smaller solder ball geometries and to improve the data capture and analysis using energy as a failure criterion. This has proven to be a reliable method with future developments ongoing.

Our 2^nd generation cold bump pull capability for example assures full compliance with JEDEC standards and offers world class analysis of microelectronic solder joint integrity and reliability. One of our biggest challenges is to maintain our investment in R&D so we can continue to deliver award winning technology that meets our customer’s challenging bondtesting inspection needs for smaller bumped device structures. R&D spending will be significantly higher in 2008 than previous years as we look to extend the functionality and range of our products.

We will continue to strengthen our service organization around the world and offer an extended range of service products including consultancy work on new applications to maintain the high quality of service that Dage customers have come to expect worldwide.

New manufacturing techniques and processes have been introduced within our operations that will allow us to significantly reduce delivery lead-times for new systems and accessories. As an established unit of the Nordson Corporation, Dage will continue to make the best use of the synergies and benefits afforded by being an integral part of this large and dynamic organization.