We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers March 19, 2008 Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Letters Submit Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Top Story   Solar market grew 62% in 2007 Despite ongoing polysilicon shortages in the market, world solar photovoltaic (PV) market installations reached a record high of 2,826 ... EETimes Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Industry News   Joseph Borel unveils 12-page proposal Joseph Borel, former executive vice president in central research and development at STMicroelectronics NV, has sent a 12-page proposal to ... EETimes Applied Materials upgraded on solar power promise Pang said he expects Applied Materials to unveil "positive developments" in its solar power business in the coming quarters. While Applied ... MarketWatch Hejian and Elpida to jointly build 12-inch fab in China Hejian Technology and Elpida Memory will jointly build a 12-inch memory fab in Suzhou, China, with the joint-venture to be named "Hefa," according ... DigiTimes Tool book-to-bills point to downturn According to Barron's, Lehman Brothers cut its capital spending forecast to minus 20-to-25 percent in 2008, down from its previous estimate of ... EETimes Analyst: Silicon MEMS microphones demand stalls The silicon MEMS microphone sector grew 12.4% in 2007 to 238M units, well off the pace of the prior two years (2005-2006) where installations ... Solid State Technology Applied retains top spot for IC manufacturing gear The leading ten IC manufacturing equipment suppliers recorded combined revenues of $33.5 billion last year, a 10 percent increase over the ... EETimes Analyst: Top IC suppliers remain largely unchanged 2007 Despite a late-year slowdown among industry and US economic uncertainty, 2007 turned out to be a decent year for major IC and related ... Solid State Technology Gloomy IC forecast seen for 2008 The Dublin, Ireland-based research firm is forecasting revenue growth in 2008 to be only 2.4 percent. ''Where 2007 was characterized by excess ... EETimes Kolkata to have chip design facility by mid-2009 West Bengal will have an India Design Centre (IDC), the first-of-its kind in the country, at the Salt Lake Sector V. The chip design facility will ... Financial Express TI high-performance analog team meets in India The core growth engine for Texas Instruments could be high-performance analog, in the opinion of its president and CEO, Rich Templeton. ... EETimes Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation Technology News   Tessera Incorporates TSVs Into Optoelectronics Packaging In a déjà vu manner, Tessera Technologies Inc. (San Jose) recently acquired a few more smart optics and imaging companies — namely ... Semiconductor International Coordinating from Silicon to Package The latest trends in both silicon implementation and chip packaging affects printed circuit board design in ways that can drive costs higher and ... Chip Design Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Corporate News Submit Kulicke & Soffa Introduces Next-Generation Wire Bonders at SEMICON China Kulicke & Soffa Industries, Inc. introduces two next-generation wire bonders at SEMICON China, in Shanghai. The first is the new IConnPS ... Kulicke & Soffa Mini lasers get their name from their compact size These robust, sealed, QCW diode pumped lasers are available at 1064nm, 532, 355 and 1.57µm. The Mini is available with energy levels up to ... RPMC Lasers Inc. BTU International Opens New Center of Excellence for Photovoltaics Process Technology BTU International announced the opening of its new Center of Excellence for Photovoltaics Process Technology in Shanghai, China. BTU opened ... BTU International Today's Sponsor ShinEtsu Resists - Perfect for 3D packaging, WLP, TSV and wafer bonding For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion. ShinEtsu Photo Resist Coating System Featuring Ultrasonic Technology USI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more… Ultrasonic Systems, Inc. Checking for Brittle Fracture Failures? Replace drop testing with high strain rate bondtesting Detecting brittle fracture failures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more… Dage Precision Industries Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. 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