We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers March 6, 2008 Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Letters Submit Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Top Story   January slowdown varied from west to east Now that we have the actual semiconductor sales figures for January 2008, courtesy of the European Semiconductor Industry Association, ... EETimes Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Industry News   iSuppli set to lower IC forecast Another market research firm is ready to lower its IC forecast.Earlier this week, Gartner Inc. slashed its IC forecast by one-half. And amid ... EETimes Actual data show January chip sales fell on annual basis Global sales of semiconductors fell in January 2008 to $19.16 billion, down 0.7 percent compared with $19.29 billion sold in January 2007, ... EETimes National Semi CEO Highlights Megatrends Driving Chip Industry Growth, Need for Greater Energy Efficiency During his keynote at the Global Electronics Forum in Osaka, Japan, Brian Halla, chairman and CEO of National Semiconductor Corp., ... ECN Asia NAND flash module makers look to balance pricing competition from Samsung Sources at memory module makers in Taiwan are indicating that because Samsung Electronics is growing its finished memory card shipments to ... DigiTimes Micron launches new CMOS image sensor division, Aptina Imaging Micron Technology announced the creation of a separate division and new identity for its CMOS imaging business with the launch of Aptina ... DigiTimes Global Solar opens new PV module plant Thin-film photovoltaic manufacturer Global Solar Energy said Wednesday it is opening a new solar-cell manufacturing plant. Global Solar said ... EETimes Seoul to boost semiconductor equipment export The Korean government said Wednesday (Mar. 5) that it plans to actively promote the export of semiconductor manufacturing equipment by ... Korea.net Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation Technology News   Contradictions in the Solar Market The solar industry is faced with a huge oversupply of solar panels planned for production in 2008, but no one seems to notice… or care. ... Seeking Alpha Unique locks on microchips could reduce hardware piracy Computer engineers at the University of Michigan and Rice University have devised a comprehensive way to head off this costly infringement ... PhysOrg 3D Packaging Processes — Part III This article is the third in a series on 3D packaging technology, and summarizes information presented during a January 2008 webcast hosted ... Advanced Packaging AMD readies 45nm quad-core Phenoms - promises more and more performance Literally snoozing our way through the near-interminable AMD press conference thrown to herald the release of the AMD 780-series chipset ... HEXUS.net Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Corporate News Submit Samsung’s GDDR4 Memory Boosts Performance of New PowerColor HD 3870 X2 Samsung Electronics Co., Ltd. announced that it is supplying its fastest GDDR4 graphics memory to TUL Corporation, a leading supplier of AMD ... Samsung dFFOZ-P™ Sensor Continuously Monitors Peroxide in SPM / Piranha Bath for Higher Yields The new dFFOZ-P™ (Dissolved Full Flow) state-of-the-art Hydrogen Peroxide Sensor from IN USA, Inc. is designed to very accurately ... IN USA, Inc. Today's Sponsor ShinEtsu Resists - Perfect for 3D packaging, WLP, TSV and wafer bonding For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion. ShinEtsu mBGA Flux deposition with ultrasonic coating technology USI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more... Ultrasonic Systems, Inc. Checking for Brittle Fracture Failures? Replace drop testing with high strain rate bondtesting Detecting brittle fracture failures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. 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