We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers February 19, 2008 Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Letters Submit Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Top Story   DRAM makers' growth goes from "first to worst" DRAM makers performed the worst in terms of revenue growth during 2007, overturning the trend a year earlier, according to a study from ... EETimes Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Industry News   UAlbany to head national nanotech research consortium, $7.5M program The state University at Albany's nanocollege will be the headquarters of a national research consortium focused on making nanoelectronic ... Business Journal Semiconductor revenues fall short of forecast The revenues for semiconductors in India during 2006 have fallen short of the forecast of India Semiconductor Association (ISA) ô Frost & ... Business Standard Silicon wafer vendors see new dynamics Silicon wafer vendors are under pressure from current demand and the new dynamics in the solar-cell industry, according to Semico Research ... EETimes Private, public drivers to fuel chips growth Telecommunications, including mobile, consumer electronics, personal computers, office automation, energy devices and medical equipment ... Business Standard Fab City project attracts 7 firms, $7 b investments The semiconductor policy that was announced by the Government about four months ago has attracted tremendous response, the Union Minister of ... Business Line Tokyo Electron, Sharp Partner For Thin-Film Solar PV Development Tokyo Electron (TEL) has reached an agreement with Sharp Corp. to establish a joint venture to commercialize plasma chemical vapor ... Solar Industry Samsung to mass produce 64GB SSDs Samsung has begun mass producing 64GB solid state drives (SSDs) with a Sata II interface, making them available as an option in selected ... Vnunet Silicon wafer vendors see new dynamics Silicon wafer vendors are under pressure from current demand and the new dynamics in the solar-cell industry, according to Semico Research ... EETimes Investor coalition pledges $10 billion for 'cleantech' A coalition of more than forty U.S. and European institutional investors, responsible for more than $1.75 trillion in assets, has ... EETimes Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Technology News   Flip-chip stereo headset amplifier boosts audio in handsets STMicroelectronics has announced the TS4601, a stereo headset amplifier that improves audio performance, extends battery life and enables ... Audio Design Line Prestigious Global Nanoelectronics Research Collaboration Awarded to UAlbany NanoCollege Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, ... Street Insider Cracking the code Over the last decade, digital signal processing (DSP) has become a significant part of semiconductor applications. The algorithms ... CIE Online Keeping the pressure Micro-electro-mechanical systems (MEMS) are attractive for a number of applications. Mike Cooke describes the use of MEMS and SAW devices ... CIE Online Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Corporate News Submit Agilent to Release Boundary Scan-VTEP Hybrid Agilent Technologies Inc. announced that it will offer in-circuit test (ICT) users an innovative way to test their printed circuit board ... Agilent Technologies Samsung Offers SATA II Solid State Drive in Volume Production Samsung Electronics Co., Ltd announced that it has begun mass producing 64 GB solid state drives (SSDs) with its new SATA II interface, ... Samsung Electronics Co. Today's Sponsor Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu White Paper: Photo Resist coating Precision coating with Ultraspray Technology Outlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper… Ultrasonic Systems, Inc. Checking for Brittle Fracture Failures? Replace drop testing with high strain rate bondtesting Detecting brittle fracture failures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more… Dage Precision Industries Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.