We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers February 13, 2008 Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Letters Submit Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Top Story   Photovoltaic semiconductor market future divides opinion Analysts are divided over the level of stability in the photovoltaic solar panels market and its effect on the semiconductors industry. ... Rapid Electronics Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Exclusive   Part 1: EU REACH Legislation: Implications for electronics, textiles and plastics industries The EU REACH legislation came into force June 2007 and looks set to become the most influential substance restriction legislation of the decade. REACH, which stands for Registration, Evaluation and Authorisation of Chemicals is essentially a complete revamp of all EU Chemical legislations ... Roland Sommer, Managing Director ROHS-International Industry News   Fujitsu tips more details of chip spin-off Japan's Fujitsu Ltd. has formally moved to split off its chip unit into a new subsidiary. The unit, Fujitsu Microelectronics Ltd., will be ... EETimes Applied Materials Says Solar To Shine In 2008 Applied Materials Inc. (AMAT) guided for higher profits in its second quarter based on more optimism about its business of selling raw ... CNN Money Brooks Automation swings to 1Q net loss; expects layoffs in 2Q Brooks Automation Inc. reported a swung to a first-quarter net loss of $1.42 million, or 2 cents a share, from a net profit of $22.1 million ... CNN Money MEMS surges to 3-mth high of 18.5 sen The share price of MEMS Technology Bhd surged more than 42% or 5.5 sen to a three-month high of 18.5 sen in active trade yesterday on news ... The Edge Daily Renesas Makes Major Gains in Multimedia Coprocessors in 2007 Riding a wave of demand for increased multimedia and computing horsepower in mobile handsets, Renesas Technology Corp. achieved ... iSuppli Corporation Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Technology News   SEMI Publishes Eight New Technical Standards SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing ... Fox Business Viewpoint: How to manage a billion cycles After years discussing verification strategies with hundreds of ASIC designers, it finally hit me: We're at the point where designers are ... EETimes The Clouds Of Economic Slowdown May Have a Silver Lining With all the talk about a slowdown in the economy — which may or may not materialize — I decided to look on the bright side and explore how ... Power Electronics Technology Sclerometry, Nanoscratching and Nanoindentation – Surface Characterisation with the NTEGRA from NT-MDT During nanoindentation the surface of a sample is displaced as pressure is applied by the tip of a probe. Analysis of the applied "Force- ... The A to Z of Manufacturing Samsung Electro-Mechanics and Nanoradio launch Wi-Fi Modules for Mobile Phones Nanoradio today announced that Samsung Electro-Mechanics, one of the world's leading electronic components manufacturers, team up in a ... SYS-CON UK Research Team Aims To Decrease Cost of Solar Energy A national team of UK scientists is embarking on one of the UK's largest ever research projects into photovoltaic (PV) energy. The £6.3 ... Renewable Energy Access Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Corporate News Submit Renesas Makes Major Gains in Multimedia Coprocessors in 2007 Riding a wave of demand for increased multimedia and computing horsepower in mobile handsets, Renesas Technology Corp. achieved ... iSuppli Corporation TechSearch Int'l Study Forecasts Realistic 3D TSV Market TechSearch International’s new report, Through Silicon Via Technology: The Ultimate Market for 3D Interconnect, provides a carefully ... TechSearch International Osram Opto Semiconductors: Trend Setter In New White Binning OSRAM introduces new, advanced fine binning for white LEDs and delivers significant improvements in off-angle color uniformity as well as a ... Osram Opto Semiconductors Agilent Introduces Serial Bus Triggering, Hardware-Based Decoding Agilent Technologies Inc. introduced serial bus triggering and real-time decode support for its 5000 Series oscilloscopes. These capabilities ... Agilent Technologies R&D Circuits Acquires Interest in Anestel Anestel Corporation James V. Russell, President of R&D Circuits and Darren Young, CEO of Anestel announces the investment in Anestel Corporation by R&D ... R&D Circuits Today's Sponsor ShinEtsu Resists - Perfect for 3D packaging, WLP, TSV and wafer bonding For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion. ShinEtsu mBGA Flux deposition with ultrasonic coating technology USI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more... Ultrasonic Systems, Inc. Control Costs and Maximize Yield Discover the XD7600NT If you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. 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