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Thursday, Sept 11, Baltimore, MD
Asymtek presents free
 coating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more…
Asymtek 
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February 4, 2008
Peter Biocca, Senior Market Development Engineer, Kester
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| Peter Biocca, Senior Market Development Engineer, Kester
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Year 2007 saw a global increase in lead-free solder use, mostly SAC. Interest in Kester’s K100LD tin/copper-based solder increased. Industries exempt from RoHS — medical, automotive, and telecom — began looking to lead-free. Kester, under ITW, realigned operations for an intimate approach to product development and support.
Our new Itasca, Ill., facility includes modern assembly equipment and our Mexico location optimized operations. In 2008, we expect growth in North American markets, particularly Mexico; and in Asia, particularly China. The transition to lead-free assembly will continue, with conversions in all regions increasing by approximately 10 percent.
Peter Biocca
, Senior Market Development Engineer
Kester
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Peter Biocca, Senior Market Development Engineer, Kester
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March 25, 2008
Phil Vere, Managing Director – Bond Testing, Dage Precision Industries
 Semiconductor packaging continues to gravitate toward 3D packaging such as package-in-package (PiP), package-on-package (PoP) and system-in-package (SiP) driven in large part by the growing functionality of handheld products. These 3D packages typically contain more bumped devices as semiconductor suppliers’ move away ...
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February 4, 2008
Peter Biocca, Senior Market Development Engineer, Kester
 Year 2007 saw a global increase in lead-free solder use, mostly SAC. Interest in Kester’s K100LD tin/copper-based solder increased. Industries exempt from RoHS — medical, automotive, and telecom — began looking to lead-free. Kester, under ITW, realigned operations for an intimate approach to product ...
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February 1, 2008
Dr. Aleksej M. Rodin, Via Team Leader, XSiL Ltd.
 Through-Silicon Vias (TSVs) for 3D Interconnects are one of the hottest topics of 2008. Two technologies can be used today to produce these vias: DRIE and laser drilling. In the past, laser drilling processes suffered from throughput and size limitations. Laser technology was then directed towards applications with low density ...
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January 31, 2008
Lyman Brown, Executive Vice President and Chief Operating Officer, BPM Microsystems
 We see 2008 as an exciting year for BPM. Global demand for OEM automotive electronics is expected to continue to grow. Quality MCU programming will be the key for the strong demand for safety, entertainment and communication systems. BPM's broad complex MCU programming support can help out ...
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January 30, 2008
John Wood, Systems Engineer, Plasma Etch, Inc.
 In our quest to provide the best value in plasma treatment equipment we have upgraded our PE-100 bench top system with an accurate mass flow meter & precision needle valve gas train. This newest PE-100 now comes standard with one mass flow meter & may be ordered with more as needed. This ...
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