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  Photo Resist Coating System
Featuring Ultrasonic Technology
Photo Resist Coating SystemUSI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more…
Ultrasonic Systems, Inc.
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Technologies for applying fluids
in Semiconductor Packaging
 Piezo Dispensing MethodThis new white paper explains how Jetting fluids in semiconductor packaging and assembly has become an enabling process allowing tighter packaging of multiple chips on a substrate. Click here to download…
Asymtek




Die Bonding Made Easy
Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
Viewpoint Index
January 31, 2008

Lyman Brown, Executive Vice President and Chief Operating Officer, BPM Microsystems

image
Lyman Brown, Executive Vice President and Chief Operating Officer, BPM Microsystems
We see 2008 as an exciting year for BPM. Global demand for OEM automotive electronics is expected to continue to grow. Quality MCU programming will be the key for the strong demand for safety, entertainment and communication systems. BPM's broad complex MCU programming support can help out automotive customers meet these challenges.

NAND and NOR flash are the dominant semiconductor memories utilized in portable electronic devices and other consumer devices. BPM Microsystems’ investment in the development and introduction of Flashstream in 2007 leave us poised to help our customers address their throughput dilemma due to device size increases.

Lyman Brown , Executive Vice President and Chief Operating Officer
BPM Microsystems

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Lyman Brown, Executive Vice President and Chief Operating Officer, BPM Microsystems


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March 25, 2008
Phil Vere, Managing Director – Bond Testing, Dage Precision Industries
imageSemiconductor packaging continues to gravitate toward 3D packaging such as package-in-package (PiP), package-on-package (PoP) and system-in-package (SiP) driven in large part by the growing functionality of handheld products. These 3D packages typically contain more bumped devices as semiconductor suppliers’ move away ...
February 4, 2008
Peter Biocca, Senior Market Development Engineer, Kester
imageYear 2007 saw a global increase in lead-free solder use, mostly SAC. Interest in Kester’s K100LD tin/copper-based solder increased. Industries exempt from RoHS — medical, automotive, and telecom — began looking to lead-free. Kester, under ITW, realigned operations for an intimate approach to product ...
February 1, 2008
Dr. Aleksej M. Rodin, Via Team Leader, XSiL Ltd.
imageThrough-Silicon Vias (TSVs) for 3D Interconnects are one of the hottest topics of 2008. Two technologies can be used today to produce these vias: DRIE and laser drilling. In the past, laser drilling processes suffered from throughput and size limitations. Laser technology was then directed towards applications with low density ...
January 31, 2008
Lyman Brown, Executive Vice President and Chief Operating Officer, BPM Microsystems
imageWe see 2008 as an exciting year for BPM. Global demand for OEM automotive electronics is expected to continue to grow. Quality MCU programming will be the key for the strong demand for safety, entertainment and communication systems. BPM's broad complex MCU programming support can help out ...
January 30, 2008
John Wood, Systems Engineer, Plasma Etch, Inc.
imageIn our quest to provide the best value in plasma treatment equipment we have upgraded our PE-100 bench top system with an accurate mass flow meter & precision needle valve gas train. This newest PE-100 now comes standard with one mass flow meter & may be ordered with more as needed. This ...
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Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation




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