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  Thursday, Sept 11, Baltimore, MD
Asymtek presents free
imagecoating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more…
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Die Bonding Made Easy
Precision X-Form Needles
imageThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology




Semicon Europa:
Where Professionals Define the Industry
imageJoin Semi October 7-9 in Stuttgart Germany for Semicon Europa and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more.
SEMI
Viewpoint Index
January 28, 2008

Henry J. Klim, President, BMC

Our focus on companies in the Microsystems and MEMS space continues to allow BMC to grow vertically with expanded knowledge and capabilities within these application spaces, yielding significant commercial revenue and in-depth knowledge of these very complex packaging, assembly, and test problems. These commercial customers are in addition to the Navy “CCAT” program, which continues in production at BMC and is the foundation that has allowed usto grow the company.

Continuing to successfully solve our customer’s technical issues and challenges in the area of assembly and packaging processes is the value we provide the companies that choose BMC. The plan for calendar year 2008 is to continue to expand our capabilities and resources to accommodate our projected growth and address the diversity of customer requirements. Working with BMC, offers our customers a wide range of expertise and capabilities.

Henry J. Klim , President
BMC

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Henry J. Klim, President, BMC


More Viewpoint Comments Index
March 25, 2008
Phil Vere, Managing Director – Bond Testing, Dage Precision Industries
imageSemiconductor packaging continues to gravitate toward 3D packaging such as package-in-package (PiP), package-on-package (PoP) and system-in-package (SiP) driven in large part by the growing functionality of handheld products. These 3D packages typically contain more bumped devices as semiconductor suppliers’ move away ...
February 4, 2008
Peter Biocca, Senior Market Development Engineer, Kester
imageYear 2007 saw a global increase in lead-free solder use, mostly SAC. Interest in Kester’s K100LD tin/copper-based solder increased. Industries exempt from RoHS — medical, automotive, and telecom — began looking to lead-free. Kester, under ITW, realigned operations for an intimate approach to product ...
February 1, 2008
Dr. Aleksej M. Rodin, Via Team Leader, XSiL Ltd.
imageThrough-Silicon Vias (TSVs) for 3D Interconnects are one of the hottest topics of 2008. Two technologies can be used today to produce these vias: DRIE and laser drilling. In the past, laser drilling processes suffered from throughput and size limitations. Laser technology was then directed towards applications with low density ...
January 31, 2008
Lyman Brown, Executive Vice President and Chief Operating Officer, BPM Microsystems
imageWe see 2008 as an exciting year for BPM. Global demand for OEM automotive electronics is expected to continue to grow. Quality MCU programming will be the key for the strong demand for safety, entertainment and communication systems. BPM's broad complex MCU programming support can help out ...
January 30, 2008
John Wood, Systems Engineer, Plasma Etch, Inc.
imageIn our quest to provide the best value in plasma treatment equipment we have upgraded our PE-100 bench top system with an accurate mass flow meter & precision needle valve gas train. This newest PE-100 now comes standard with one mass flow meter & may be ordered with more as needed. This ...
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